Intel Broadwell CPUs will Get BGA Casing

The Internet community is energetically discussing unofficial info concerning the future Intel's Broadwell processors. According to the yet unacknowledged data, Intel will branch off from currently traditional LGA casings in favor to a more advanced BGA solution. At present all CPUs designed by Intel specifically for desktop platforms feature LGA (Land Grid Array) casings which allow the users to upgrade their systems without any hassle. On LGA implementation, the chip is housed within a socket and contacts with the motherboard. As a result, the user might change one chip to the other only with similar set of contacts.

The launch of Intel Broadwell processors, which is planned for 2014, might dramatically change the situation for customers. Most probably Intel will refuse from LGA casings and accommodate all new CPUs in BGA ones, marking the change of Haswell generation to the future Broadwell generation developed under 14 nm technological process. BGA (Ball Grid Array) …

Deepcool Comes Out with Tesseract SW-RD Chassis

Deepcool Industries Co. Ltd. has expanded its production line with a new mid-tower case, entitled Tesseract SW-RD. The chassis features 472x210x454 mm dimensions and weighs 4.97 kg. It is made of galvanized SECC steel plates, boasting a large side acrylic window & black-and-red frontal frame. The top panel houses I/O panel with a pair of USB ports (both 2.0 and 3.0 versions are available) as well as a couple of audio ports.

Deepcool Tesseract SW-RD is compatible with mini-ITX, micro-ATX and ATX motherboards. The layout offers two external 5.25-inch slots, four internal 3.5-inch slots, three internal 2.5-inch slots, and seven slots for PCI expansion cards. All the racks are equipped with slides which facilitate installation of drives without any screws.

To continue, the case is ready to welcome 310-mm-long VGA cards, 168-mm-high CPU coolers as well as standard power supply units. The motherboard tray accommodates a dedicated notch that allows installing the CPU cooler …

Enermax to Announce a New Mid-Tower Case Fulmo ST

Enermax Technology, an established Taiwanese developer of various PC hardware components, is about to announce its new roomy PC case within the boundaries of Fulmo series. Codenamed Fulmo ST, the case is designed in mid-tower form-factor and is distinguished by massy dimensions. Featuring 485x244x513 mm, the product’s weight approximates 8.2 kg. The novice will be available in two color variations: gray (ECA3270A-G-BL) and black (ECA3270A-B-BL).

Fulmo ST is ready to accommodate up to eight PCI expansion cards, three 5.25-inch drives and eight drives either of 3.5- or 2.5-inch standard. The case is compatible with ATX and micro-ATX motherboards, quite lengthy graphics cards (up to 412 mm if demounting the top HDD/SSD bay), as well as rather lengthy dual-heatsink for the water-cooling system (up to 280 mm). The latter might be replenished by ten fans of either 120 mm or 140 mm dimensional type.

Upon the whole, Enermax will deliver its Fulmo ST case with three …
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Registered at: 08 January 2012, 11:02
Last visit: 29 November 2012, 23:39