The Introduction of Transparent Chassis from Scythe

Scythe has recently amazed the community by the introduction of absolutely transparent chassis. ACB-Type3 model preserves the cutout of the standard Mid-Tower chassis solutions, but is made of transparent acrylic plates. One more peculiarity of this model is the parallel to the base localization of motherboard. Besides, ACB-Type3 is compatible with motherboards of various form-factor, including mini-ITX, micro-ATX, and ATX.



The motherboard is accommodated on a special tray. Right under this tray the customers are able to find a set of bays designated for the installation of PSU, three 3.5-inch drives, a couple of 2.5-inch drives, and three 5.25-inch drives. The chassis is compatible with CPU coolers of up to 190 mm in height.


At the same time, this model goes without any fans or side panels; this attributes the model to Open-Air segment. The product can content itself with practically noiseless passive system.


Scythe ACB-Type3 is equipped with sufficient number of …

NZXT to Release Revolutionary Manta Chassis

NZXT has been always differentiated by an extraordinary design of PC chassis. This time the company decided not to drift off the course and introduced a revolutionary mini-ITX case. The Manta features 450x426x245 mm dimensions only, but it can accommodate an advanced system with quite powerful components. Exterior (black-and-white or black-and-red coloring) is notable for salient shapes and a stylish transparent window.



NZXT Manta offers enough internal space to build up a record-breaking mini-ITX system. It is ready to house a two-slot videocard of 363 mm in length, standard ATX power supply unit as well as a typical CPU cooler of 160 mm in height. The case boasts two expansion slots and promotes for brilliant opportunities to build a voluminous storage subsystem, consisting of two seats for 3.5-inch drives and three seats for 2.5-inch drives.


The connection of external peripherals is realized via two USB 3.0 ports & a couple of 3.5-mm audio ports.


Cooling system …

Next year TSMC will start manufacturing the first 20nm chips

The Taiwanese company TSMC confirmed its intention to start production of chips using 20 nm technological processes in 2013. However, for now the company does not plan its production on an industrial scale and will release the first chips in a limited quantities, giving them a total of 1% of production capacity. According to the head of the company, the mass production of semiconductor chips with this technology will not begin until 2014.



Meanwhile TSMC Company is going to produce only one version of the chip, which will be able to enter into the wide range of devices, from smart phones with low-power to high-performance graphics cards. For comparison, the Taiwanese company currently has four different output chips on 28-nm technology. These are 28LP (poly / SiON) for low-power low-cost chips, 28HPL (HKMG) for use in low power applications, 28HP (HKMG) for high-performance chips and 28HPM (HKMG). The latest version combines elements of high-performance chips with high efficiency …
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Registered at: 03 September 2011, 01:52
Last visit: 03 September 2011, 02:09