Deepcool to Release Neptwin V2 CPU Cooler

Deepcool Industries Co. LTD has enriched its production line with a new CPU cooler, entitled Neptwin V2. Featuring 125x136x159 mm dimensions, the model allows for the installation of up to four fans, combined with a nickel-plated base, six copper heat pipes and a two-section voluminous heatsink which consists of 80 ribs (40 ribs for each section).



This cooler is known to support all up-to-date platforms, developed by Intel and AMD. As distinct from the majority of rivals, the Neptwin V2 framework is ready to accept four fans which operate by means of PWM technology. The base version comes with only two fans. The first one – Deepcool Wind Blade 120 – is equipped with a blue backlight; its rotational speed range varies from 900 to 1500 RPM. The second fan rotates at 1300 RPM. An overall noise level fluctuates within 21.4-32.1 dB boundaries.


It should be mentioned that total airflow volume produced by the fans might achieve 110.8-237.15 m/h. As a result, the cooler is …

SilverStone Heligon HE01 - a new super-cooler

The Taiwanese company introduced a bulky cooler SilverStone Heligon HE01, which is designed to cool down more or less all types of modern CPUs — from Intel LGA775 up to LGA2011 and from AMD AM2 to AMD AM3 + / FM2.



The construction does not weigh less than 1.1 kg, since in addition to two-part radiator (926 g) it is equipped with fan of 140x140x38 mm size. Linear dimensions of Heligon HE01 are 140 mm in width, 119 mm in length and 160 mm in height. Staples that hold the fan, take a few millimetres of space.


The thickness of a pair of «towers», joined by six nickel-plated copper heat pipes with a diameter of 6 mm, is uneven. The intense air flow passes successively through a thin array of aluminium fins, and then through the fan, afterwards through a larger section of the radiator. Copper base with nickel cover is protected with a film from scratches.


The manufacturer claims that Heligon HE01 will cope with the withdrawal of 300 watts of heating power.


Regular …

Intel Broadwell CPUs will Get BGA Casing

The Internet community is energetically discussing unofficial info concerning the future Intel's Broadwell processors. According to the yet unacknowledged data, Intel will branch off from currently traditional LGA casings in favor to a more advanced BGA solution. At present all CPUs designed by Intel specifically for desktop platforms feature LGA (Land Grid Array) casings which allow the users to upgrade their systems without any hassle. On LGA implementation, the chip is housed within a socket and contacts with the motherboard. As a result, the user might change one chip to the other only with similar set of contacts.



The launch of Intel Broadwell processors, which is planned for 2014, might dramatically change the situation for customers. Most probably Intel will refuse from LGA casings and accommodate all new CPUs in BGA ones, marking the change of Haswell generation to the future Broadwell generation developed under 14 nm technological process. BGA (Ball Grid Array) …
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Registered at: 15 January 2012, 19:27
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