Intel Makes an Agreement with ASML to Accelerate 450 mm Wafer Development

The past several days were marked by the Intel's announcement about the celebration of a contract with ASML company. Such step has been dictated by the company's intentions to invest into the development of 450 mm wafers and EUV technologies. In accordance with the preliminary estimates, the general investment rate will reach $4.1 billion. The major target of the cooperation is to decrease the term of lithography equipment commissioning by two years, and stimulate the development of technologies targeted at 450 mm wafers. The implementation of the predesigned plans will allow the manufacturers of semiconductor components to receive a range of benefits, among which is the cut of expenses.

With the purpose to facilitate in the solution of this technological problem, Intel will take part in a dedicated program. This program includes financial backup of scientific and research projects, as well as, equity investing campaigns in ASML.

The initial stage of this program …

Greeting New HIS R7 260 iCooler 1GB GDDR5 Graphics Card

The lineup of graphics cards designed by HIS has been replenished with a new Radeon R7 260 model. Entitled HIS R7 260 iCooler 1GB GDDR5, the new-comer employs a typical PCI Express 3.0 x16 interface and comes with etalon clock frequencies. The R7 260 GPU (GCN, 28 nm) with 768 CUDA cores runs at 1000 MHz. It is accompanied by 1 GB of GDDR5 memory (128-bit bus) that operates at 1500 MHz/ 6000 MHz typical/effective frequency.

This adapter receives power through one 6-contact connector. Connectivity with PC monitors is realized due to three video ports: DisplayPort, HDMI and DVI-I. GPU and memory modules are cooled down by the forces of iCooler. It is not differentiated by an offbeat design; it consists of an aluminum heatsink and one low-profile fan.

Still, it offers acoustic convenience while fulfilling standard tasks: the maximal noise level does not exceed the limit of 28 dB. A supplementary aluminum heatspreader can be found in power supply section.

The HIS R7 260 …

‘Cubic’ Chassis Corsair Carbide Air 540 Review

Corsair is renowned for the whole galaxy of products designed for contemporary PC platforms. Its PSUs, memory modules, SSDs, cooling solutions, peripherals, and cases are widely incorporated in desktop and mobile segments. The latter count a list of series, targeted various customers with various needs. The most peculiar one is Carbide series that currently consists of eight models. Carbide Air 540 differs from its comrades, in the first place, by its cubic framework and, in the second place, by its mini-tower height but midi-tower internal spacing. Those are not the only attractions of the model, since Corsair always offers more than it’s seen on the surface.

Design and Ergonomics

Corsair Carbide Air 540 features 458x322x419 mm dimensions and is distinguished by a rather strict design. Exterior and interior facets are totally painted black, except for ‘Corsair’ label and sockets with inscriptions. The case is made of thin steel but for the external plastic panels …
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Registered at: 23 September 2012, 08:28
Last visit: 24 September 2012, 07:40