Aresze Announces Chassis with Noiseless Cooling System

Enthusiasts and gamers might sigh with relief after their prolonged attempts to find the chassis for the creation of high-performance gaming systems. Aresze is going to release chassis, codenamed Seediq 8003, of new generation which is a perfect match for high-end gaming systems with unique cooling facilities. The chassis is developed in midi-tower form factor and features 520x215x508 mm dimensions. The casing is made of steel alloy, and is ready to accommodate motherboards of micro-ATX and ATX standards.

Despite the average dimensions, Aresze Seediq 8003 is compatible with CPU fans of 175 mm in height, large graphics adapters of up to 300 mm in length with HDD bays and up to 430 mm – without HDD bays, as well as, power supply units of ATX/EPS standard. This chassis has got quite efficient internal layout. Hence, it's equipped with ten sections for drives (four external 5.25 inch drives and six internal 2.5- 3.5 inch drives) and eight PCI slots for four graphics adapters.
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Seagate Backup Plus to Protect the Digital Media Content

A new set of customer repositories has been recently introduced by the Seagate, a global hard drive manufacturer. The new product offers an innovative approach towards file storage as well as a completely fresh technology of backup from the social networks. Seagate Backup Plus is called to ensure several operations at once: unpretentious installation, ‘single click’ backup activity and capability to store and publish the media content from Facebook and Flickr services.

Backup Plus is the first external hard drive that provides customers with the possibilities to store all content from social networks in one place, without the fear of file loss. This hard drive enables quick and efficient backup of photo copies and secures all quality standards without the minimal damages. The new set of repositories looks rather stylish and goes in blue, red, black and silver color gamut. It comes with USB 3.0 cable and is capable to work with other adapters such as Thunderbolt and …

Intel Makes an Agreement with ASML to Accelerate 450 mm Wafer Development

The past several days were marked by the Intel's announcement about the celebration of a contract with ASML company. Such step has been dictated by the company's intentions to invest into the development of 450 mm wafers and EUV technologies. In accordance with the preliminary estimates, the general investment rate will reach $4.1 billion. The major target of the cooperation is to decrease the term of lithography equipment commissioning by two years, and stimulate the development of technologies targeted at 450 mm wafers. The implementation of the predesigned plans will allow the manufacturers of semiconductor components to receive a range of benefits, among which is the cut of expenses.

With the purpose to facilitate in the solution of this technological problem, Intel will take part in a dedicated program. This program includes financial backup of scientific and research projects, as well as, equity investing campaigns in ASML.

The initial stage of this program …
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Registered at: 04 May 2012, 18:50
Last visit: 04 May 2012, 18:50