Thermalright Shows up a Hard-Hitting Archon IB-E X2 Cooler

Thermalright is about to release a new ‘tower’ CPU cooler, codenamed Archon IB-E X2. Featuring 155x106x170 mm dimensions, the model supports Intel LGA 2011/115x and AMD FM1/AM2+/AM3+/FM2+ platforms. The launch date is on hold, though the recommended price might rise up 65 EUR.



Thermalright Archon IB-E X2 consists of a voluminous aluminum heatsink with 43 thin pins, which are pierced by eight U-shape nickel-plated heatpipes, and a polished copper base also with a nickel-plated coverage.


The framework is replenished by two 140 mm fans Thermalright TY-141; they are thought to support PWM technology that promotes for speed variation from 900 RPM to 1300 RPM. The fan blades produce up to 74 CFM airflow, consuming not more than 2.4 W power. Average noise level fluctuates within the measures of 17-21 dB.


Moreover, the vendor equips the cooler with a brand thermal compound — Thermalright Chill Factor III. The latter transcends common Chill Factor item in terms of heat …

HGST Announces Corporate-Class Ultrastar C10K1800 Hard Drives

Despite the emergence of ultra-fast and voluminous SSD devices, data processing centers still require classical storage solutions. Hence, HGST, an affiliate company of Western Digital, decided to comply with the corporate demands by introducing budgetary hard drives entitled Ultrastar C10K1800. The new-comers are targeting exactly DPC-systems which are in need of high performance combined with fail-safe behavior.



HGST Ultrastar C10K1800 drives feature 2.5-inch form-factor and come in diverse capacity variations (from 300 GB to 1.8 TB). The models employ SAS interface with 12 Gb/sec throughput. It should be noted that designers involved the minimal amount of plates on the maximal possible tape density. The latter are thought to rotate with 10.520 RPM.


The implementation of only few plates provides for the reduction of power consumption; this is supposed to be a great benefit since the drives are estimated for a durable 24/7 operation. Thus, an average power consumption …

AMD Highlights Plans for the Transition to the 28nm Process

AMD is a company known for the continual and elaborate work on the development and improvement of all product lines, as well as technological standards. Thus, the coming 2013 year is supposed to be portentous for the company in terms of the implementation of 28nm standards in their APU. AMD has recently voiced the plans for the change of the Trinity APU to a new model, codenamed Richland, and the transition to 28nm technological process.



The new APU, Richland, is presumably to be released in two versions: dual-core and quad-core. It will support a number of high-performance technologies, such as Blu-ray 3D, dual graphics, Open CL, AMD turbo core overclocking, and some others.


According to the preliminary information, Richland will employ FM2 socket (which Trinity employs) and Radeon 8000 series DirextX 11 GPU. This GPU will be furnished with 128 cores in dual-core model line, and with 384 cores in the high-end A10 APU. The same number of cores has been implemented in …
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Registered at: 07 April 2012, 13:01
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