SilverStone Comes Out with Precision PS12 Chassis

The lineup of tower cases developed by SilverStone has been replenished by a new price-efficient solution, entitled Precision PS12. The model features 405x360x170 mm dimensions and is ready to accommodate small-sized motherboards (mini-ITX, micro-ATX) as well as four expansion cards. The chassis is made of high-quality plastic, supplemented by a fine-meshed metallic grid on the front panel.



Inside, there is a single rack for the installation of optical drives; it’s estimated for two 5.25-inch units. There is also space for 4x 3.5-inch drives and 1x 2.5-inch drive. Hence, there is little space for graphics adapters, the length of which should not exceed 358 mm. The layout is intended for 140-mm high CPU coolers & standard ATX PS/2 power supply units.


SilverStone Precision PS12 is shipped with a single preinstalled 120-mm fan (front panel). Additionally, it’s possible to include one 80-mm fan (front panel) and one 80-/92-mm fan (rear panel). Pricing is set at $45.

Welcome In New LPDDR4 Memory Chips from Samsung

Samsung settles down to a large-scale production of LPDDR4 mobile memory chips. Elaborated according to 20 nm technological norms, the new-comers boast the integration of an advanced technology that ensures 8 Gb crystal density and twice the performance compared with LPDDR3 chips. Currently, the company produces models of 2 GB and 3 GB capacity, however in early 2015 it will set to the development of 4 GB solutions.



New LPDDR4 memory modules are targeting various mobile devices with thirst for lightning-fast data transfer speed. The latter index might accelerate up to 3200 Mb/sec; this will allow employing chips for the implementation of resource-intensive tasks, such as recording and playback of high-resolution video or serial filming.


Samsung developers claim that 2 GB LPDDR4 DRAM is 40% more power-efficient than counterparts with 4 Gb crystal density. This became possible due to the adopting of low-voltage swing-terminated logic for I/O signaling. As a result, the …

Official Presentation of CPU Cooler Thermaltake BigTyp Revo

Thermaltake, a world-known producer of thermal solutions, chassis and PSU, has officially presented its new CPU cooler modification, codenamed BigTyp Revo. This model has already been introduced at Computex 2012 where it got a lot of encouraging reviews and good prospects for the sale campaign. BigTyp Revo is considered to be an efficient solution for the cooling down of the around-socket spacing due to the horizontal radiator localization. Thermaltake representatives underline that their new product is compatible with Intel (LGA775/1155/1156/1366/2011) and AMD (Socket AM2(+)/AM3(+)/FM1) platforms.



BigTyp Revo framework consists of a compact radiator, low-noise fan, five heat pipes and a set of aluminum plates. The new model has got an aluminum base and is furnished with five copper heat pipes (6 mm each). Each of the pipes directly 'gets in touch' with the CPU surface, providing an outstanding heat removal power. The top of the radiator accommodates 120 mm fan which can be …
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Registered at: 21 August 2012, 13:52
Last visit: 21 August 2012, 14:29