Qualcomm to Enter Into Contract with GlobalFoundries

Qualcomm, a world-known provider of chips for mobile gadgets, has entered into a contract with GlobalFoundries company with the intention to develop chips based on 28 nm technology. Such information has been voiced by an authoritative Chinese publication Commercial Times, referring to the reliable sources. It is presupposed that the manufacturer will start the first dispatches for Qualcomm in the end of this year. The previously voiced data claimed that Qualcomm had arranged orders of 28 nm chips from UMC with the similar dispatch dates.



The estimated reason for the cooperation with GlobalFoundries is the insufficient delivery of 28 nm chips by TSMC. Moreover, Nvidia is supposedly targeting at the cooperation with one more manufacturer except for the TSMC as well. It should be mentioned that the preliminary memorandum between Qualcomm and GlobalFoundries was concluded in 2010; according to this memorandum, the designer got the access towards 45 nm LP and 28 nm LP technological …

Foxconn Introduces a Set of Motherboards for Intel Haswell Processors

Foxconn announces the release of several new motherboards, based on Intel H87 and B85 chipsets. The set consists of four models – B85MX, B85MX-D, H87MX, H87MX-D – compatible with the fourth generation Intel Core processors for Socket LGA 1150. The quad is intended for the assembling of small-sized mATX PCs, such as multifunctional office engines or powerful home multimedia centers.



The most outstanding peculiarities pertained to the new motherboards from Foxconn are seen in the support of PCI Express 3.0 bus with the bandwidth of 10 Gb/sec. The interface of the new generation allows integrating the most efficient graphics cards (and other peripherals) by means of dedicated PCIe sockets. Connectivity is supported due to dedicated SATA III ports and USB 3.0 ports.


The boards might accommodate up to 32 GB of DDR3 memory with clock frequencies up to 1600 MHz. The availability of an advanced Realtek audio controller ensures the production of a pure 5.1-channel sounding. …

SilverStone Heligon HE01 - a new super-cooler

The Taiwanese company introduced a bulky cooler SilverStone Heligon HE01, which is designed to cool down more or less all types of modern CPUs — from Intel LGA775 up to LGA2011 and from AMD AM2 to AMD AM3 + / FM2.



The construction does not weigh less than 1.1 kg, since in addition to two-part radiator (926 g) it is equipped with fan of 140x140x38 mm size. Linear dimensions of Heligon HE01 are 140 mm in width, 119 mm in length and 160 mm in height. Staples that hold the fan, take a few millimetres of space.


The thickness of a pair of «towers», joined by six nickel-plated copper heat pipes with a diameter of 6 mm, is uneven. The intense air flow passes successively through a thin array of aluminium fins, and then through the fan, afterwards through a larger section of the radiator. Copper base with nickel cover is protected with a film from scratches.


The manufacturer claims that Heligon HE01 will cope with the withdrawal of 300 watts of heating power.


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