Spire Debuts with Gaming PC Chassis X2.6019

Spire Corporation put itself on record with a new gaming PC chassis, codenamed X2.6019. The new-comer is developed in mid-tower form-factor, featuring 520x215x508 mm dimensions, and is made of 0.6 mm cold-rolled galvanized steel (SECC). Despite medium dimensions, it might easily accommodate motherboards of miniITX, microATX and ATX standard. According to Spire, this model belongs to MOD solutions, since it ensures an easy access to the hardware components during modification or update of the system.

Spire X2.6019 houses four external bays for 5.25-inch drives, six internal bays for 3.5-inch drives, as well as seven slots for PCI expansion cards. Its internal layout is divided by linear plates into three sections; such framework promotes for a better heat removal. It should be mentioned that this chassis is able to lodge nearly any CPU cooler and any high-end graphics card. Moreover, drive mounting can be realized without any dedicated tools.

To continue, this PC chassis …

Liquid-Cooling System Zalman LQ315 Review

A few months after the last release of water-cooling systems, Zalman introduces a new series of products with a title attribute LQ3xx. The series consists of three models, LQ320, LQ315 and LQ310, which differentiate themselves primarily by dimensions. The senior cooler (LQ320) features 32 mm water block and 52 mm heatsink, the medium LQ315 cooler features 38 mm heatsink and analogous in dimensions water block; the junior cooler (LQ310) is the tiniest one and features 28 mm heatsink and water block. Zalman LQ315 greatly resembles its predecessor, CNPS20LQ, in design, however, is ready to offer some improved options, if compared with the previous cooler generations.

Design and Framework

Like any other water-cooling system, Zalman LQ315 consists of a water block combined with a pump and joined with a heatsink by means of flexible tubes. The water block is notable by the availability of 'Z' logo on its surface that is lighted blue during operation. Its round base, made of …

Next year TSMC will start manufacturing the first 20nm chips

The Taiwanese company TSMC confirmed its intention to start production of chips using 20 nm technological processes in 2013. However, for now the company does not plan its production on an industrial scale and will release the first chips in a limited quantities, giving them a total of 1% of production capacity. According to the head of the company, the mass production of semiconductor chips with this technology will not begin until 2014.

Meanwhile TSMC Company is going to produce only one version of the chip, which will be able to enter into the wide range of devices, from smart phones with low-power to high-performance graphics cards. For comparison, the Taiwanese company currently has four different output chips on 28-nm technology. These are 28LP (poly / SiON) for low-power low-cost chips, 28HPL (HKMG) for use in low power applications, 28HP (HKMG) for high-performance chips and 28HPM (HKMG). The latest version combines elements of high-performance chips with high efficiency …
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Registered at: 20 November 2012, 05:58
Last visit: 21 November 2012, 06:26