New CPU Cooler for Small-Sized PCs from Thermalright

Thermalright boasts the release of a new CPU cooler AXP-100. The new arrival is targeting small-sized PC systems, featuring 121x105.5x58 mm dimensions. Similar to other items that take responsibility for proper CPU cooling, this model is able to provide an efficient heat extraction from processor surface and its surrounding crucial components. It is compatible with the majority of AMD and Intel sockets to guarantee its universal utilization. Hence, it supports AMD FM1, FM2, AM2, AM2+, AM3, AM3+, and Intel LGA (2011, 1366, 1156, 1155, 775) platforms.



Thermalright decided not to apply the so popular nowadays 'direct contact' technology, implying the direct contact of CPU cover with heat pipes. Instead, the cooler's framework has been given a bit different approach.


Model AXP-100 consists of a copper, nickel-plated base, six copper heat pipes, a set of aluminum ribs located parallel to the motherboard, and an atypical in its nature fan TY-100. The heatpipes spring from the …

Intel Makes an Agreement with ASML to Accelerate 450 mm Wafer Development

The past several days were marked by the Intel's announcement about the celebration of a contract with ASML company. Such step has been dictated by the company's intentions to invest into the development of 450 mm wafers and EUV technologies. In accordance with the preliminary estimates, the general investment rate will reach $4.1 billion. The major target of the cooperation is to decrease the term of lithography equipment commissioning by two years, and stimulate the development of technologies targeted at 450 mm wafers. The implementation of the predesigned plans will allow the manufacturers of semiconductor components to receive a range of benefits, among which is the cut of expenses.



With the purpose to facilitate in the solution of this technological problem, Intel will take part in a dedicated program. This program includes financial backup of scientific and research projects, as well as, equity investing campaigns in ASML.


The initial stage of this program …

Motherboard Gigabyte Z77MX-D3H TH Review

Each new year brings new ideas for the developers of PC hardware. Since motherboards are indisputably the main component in the PC integration, their design and facilities are given the most attention. Hence, each manufacturer tries to implement some unprecedented technologies to attract potential audience by an improved performance and possibilities. Intel Thunderbolt technology is a hit of 2012; that is why, motherboard designers turned their looks into this direction. Gigabyte was among the first companies to integrate Thunderbolt interface into its products: model Z77MX-D3H TH is a bright evidence of it.



Integration


Motherboard Gigabyte Z77MX-D3H TH resembles the modification of its predecessor Z77MX-D3H, except for the availability of Thunderbolt interface and design of PCB. The renunciation of the third PCIe x16 slot allowed the manufacturer to free four lines of PCIe bus and employ Thunderbolt technology for their activation. As a result, a new product has got a …
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Registered at: 21 January 2012, 21:47
Last visit: 21 January 2012, 21:47