Motherboard ASRock Z77 Extreme9 Review

Motherboards intended for gaming systems are developed and supplied by several reputable companies. ASRock belongs to their army and frequently releases motherboards with outstanding parameters. Its latest creation ASRock Z77 Extreme9 model is designed specifically for LGA 1155 socket and Intel Z77 processor. It is able to provide the users with appropriate efficiency and multiple opportunities to create a really high-performance gaming system.


Design of motherboard ASRock Z77 Extreme9 is not peculiar for the implementation of bright colors or excessive ornamental elements. Only gold yellow capacitors and decorative stripes on radiators add some glamor to the board. One of the stripes is lighted up by white LED; this option is provided by LED Heatsink Design facility. The motherboard is developed in ATX form-factor. Power supply is realized by means of Digi Power digital system that works by 8+4 scheme. All hot converter components are covered by a solid …

Ultrathin 2.5-inch SSDs from Biwin

Biwin America, Inc., a global manufacturer of solid-state drive solutions for client and corporate needs, has officially announced the release of 2.5-inch SSDs with slim-profile casings. It should be mentioned that decrease in casing dimensions touched upon all 2.5-inch products and series manufactured by the company, including Smart, Pro and Elite Series with SATA 3 and SATA 2 interfaces, as well as Drive NX and NuvoDrive PX Series with SATA 3 interfaces.

Previously all SSDs were developed in 9.5 mm-thin casings, but the current modifications allowed Biwin to decrease the dimensions to 7 mm. This is twenty-six percent less than with preceding models. Hence, slim-profile SSDs are applicable in more compact devices; they are destined to be installed in 1U and 2U server stands. This is called to increase the deployment capacity of the server without sufficient investments. Biwin 7 mm SSDs casings are made of black anodized aluminum to ensure fail-proof characteristics of the …

G.Skill Showcases New RAM Memory Modules TridentX DDR3

Long-awaited Computex 2013 has brought to light the whole galaxy of innovative hardware ideas. RAM market has also replenished with new entries, partially due to G.Skill International. Its new RAM modules, codenamed TridentX DDR3, are an embodiment of utmost performance, reliability and compatibility. The new-comers have been developed to support the latest Intel’s Haswell-based CPUs i3/i5/i7, integrated into Intel Z87 Express chipset.

TridentX DDR3 are introduced by sets of two and four 240-contact DIMM modules, the total capacity of which achieves 8 GB, 16 GB and 32 GB. All of them are equipped with original in design heatspreaders. They are also known to support Intel XMP overclocking profiles and to operate at 1.65 V power voltage.

Detailed Specifications

TridentX DDR3-3000 modules will be available in 4x8 GB kits (32 GB). Their effective frequency showings make up 3000 MHz with 12-14-14-35 latencies.

TridentX DDR3-2933 modules will be available in 2x4 …
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Registered at: 22 September 2012, 12:21
Last visit: 22 September 2012, 12:21