ASUS Maximus V GENE Layout and Design Features

Contemporary users have become rather exigent towards the functional capabilities of various devices. That is because all people expect instant reaction of their devices on multiple requests despite the purpose of usage: either the purpose of PC employment is business or a game. High-end motherboard is able to satisfy any thoroughgoing requirements of users with any needs and preferences.

ASUS has gained reputation for being in the top list of companies which produce notebooks, PCs and computer equipment. The company has recently released a new motherboard model Maximus V GENE which is already in the top list of products of the same category.

ASUS Maximus V GENE works with Intel Core processors in mATX format. People with the particular requirements towards the design will be more than fascinated by the black and red cabinet. The density of element compactness is the most striking item in the design which leaves practically no space on the board. ASUS Maximus V GENE …

Sapphire Introduces Edgy R9 290 Vapor-X OC Graphics Card

Sapphire Technology Ltd., the first-string supplier of graphics cards based on AMD chips, introduces its proprietary version of Radeon R9 290 adapter – R9 290 Vapor-X OC. As seen from the title, the model features an original Vapor-X cooler with three low-noise fans and has received factory overclocking. Bright design and outstanding performance makes this card a desirable acquirement for enthusiasts and overclockers.

Sapphire R9 290 Vapor-X OC is based on Hawaii PRO GPU (28 nm, GCN architecture) with 2560 stream processors. It runs at 1030 MHz frequency. The chip is accompanied by 4 GB of GDDR5 memory (512-bit interface) that operates at 5600 MHz effective frequency. The card is developed for PCI Express 3.0 x16 rail and is powered through a pair of sockets: 1x 8-pin and 1x 6-pin.

The award-winning Vapor-X cooler consists of an evaporator and five heatpipes. The main heat-pipe features 10 mm diameter, two other – 8 mm, and the last two – 6 mm. This combination is …

Intel Makes an Agreement with ASML to Accelerate 450 mm Wafer Development

The past several days were marked by the Intel's announcement about the celebration of a contract with ASML company. Such step has been dictated by the company's intentions to invest into the development of 450 mm wafers and EUV technologies. In accordance with the preliminary estimates, the general investment rate will reach $4.1 billion. The major target of the cooperation is to decrease the term of lithography equipment commissioning by two years, and stimulate the development of technologies targeted at 450 mm wafers. The implementation of the predesigned plans will allow the manufacturers of semiconductor components to receive a range of benefits, among which is the cut of expenses.

With the purpose to facilitate in the solution of this technological problem, Intel will take part in a dedicated program. This program includes financial backup of scientific and research projects, as well as, equity investing campaigns in ASML.

The initial stage of this program …
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Registered at: 18 July 2011, 14:35
Last visit: 18 July 2011, 15:06