Graphics Card HIS 7850 IceQ X Turbo X Review

The number of graphics solutions designed by HIS cannot be figured from a cursory calculation only. Indeed, the company's product line counts dozens of cards destined at various audiences, with various needs and budgets. Take HIS HD 7850 series alone: it consists of ten models (three with 1GB memory and seven with 2GB memory). The latest HIS 7850 IceQ X Turbo X belongs to '2GB echelon' and is distinguished by the heightened GPU and memory frequency. Upon the whole, this graphics adapter features outstanding cooling and overclocking facilities.

Design and PCB

Graphics adapter HIS 7850 IceQ X Turbo X is a standard representative of the second HD 7850 revision. It is housed on a short printed circuit board and is equipped with only a single power socket, two heatpipes and a large fan. HIS developers advanced the heatpipes outside the board to elongate its contours; nevertheless, this card can't be considered voluminous, since its width hasn't been touched at all. The top part …

Full-Tower Chassis Fractal Design Arc XL Review

Fractal Design approved itself as a reputable manufacturer of PC chassis long time ago. Nowadays, the company’s inventory embraces four lines of cases, intended for varied customer groups. Curiously enough, Arc series is a twin-brother of Define series in terms of framework, although it is differentiated by an improved ventilation. The Arc XL is a large-scale representative of the line, featuring a sleek design and offering huge integration facilities.

Basic Features

Fractal Design Arc XL is a full-tower chassis featuring 572x232x552 mm dimensions. The case is made of black steel with plastic inclusions. Its internal layout is ready to accommodate all types of motherboards, including the largest formats (XL-ATX, E-ATX, ATX, mini-ITX, micro-ATX). Storage section is rich in four 5.25-inch drive cages (external) and ten 3.5/2.5-inch cages (internal). The availability of nine expansion slots allows for the creation of various graphics and multimedia configurations.

A …

Intel Broadwell CPUs will Get BGA Casing

The Internet community is energetically discussing unofficial info concerning the future Intel's Broadwell processors. According to the yet unacknowledged data, Intel will branch off from currently traditional LGA casings in favor to a more advanced BGA solution. At present all CPUs designed by Intel specifically for desktop platforms feature LGA (Land Grid Array) casings which allow the users to upgrade their systems without any hassle. On LGA implementation, the chip is housed within a socket and contacts with the motherboard. As a result, the user might change one chip to the other only with similar set of contacts.

The launch of Intel Broadwell processors, which is planned for 2014, might dramatically change the situation for customers. Most probably Intel will refuse from LGA casings and accommodate all new CPUs in BGA ones, marking the change of Haswell generation to the future Broadwell generation developed under 14 nm technological process. BGA (Ball Grid Array) …
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