Buffalo Announces HD-PCFU3-C Wearables

Buffalo Technology is about to release its newest line of wearable hard drives. Codenamed HD-PCFU3-C, the products will be available in three capacity versions: 500 GB, 1 TB, and 2 TB. All of them allow as pure black so pure white exterior design. The models will be backed by 1 year limited warranty.

The Buffalo HD-PCFU3-C external HDs are housed in solid aluminum cases and equipped with a high-speed USB 3.0 interface. The latter might be used both for data transfer as well as charge-in purposes; put it otherwise, the user will be saved from the necessity to buy an additional AC adaptor.

Pricewise, the cheapest solutions are 500 GB HD-PCF500U3-BC and HD-PCF500U3-WC with the price tag of $90. The HD-PCF1.0U3-BWC and HD-PCF1.0U3-BBC of 1 TB capacity will cost about $110, whereas their senior companions, the PCF2.0U3-GBC and HD-PCF2.0U3-GWC of 2 TB capacity, will go as high as $165. Shipping is to start in early January 2015.

New Riing Silent 12 Pro Cooler from Thermaltake Was Spotted

Thermaltake hit the market with an exceptional CPU cooler, entitled Riing Silent 12 Pro. The model is available in two color palettes: blue & red. There the differentiation dropped. Both greenhorns support the majority of modern PC platforms, including Intel Socket LGA2011-3/775/115x/1366/2011 & AMD Socket FM1/FM2/AM2/AM2+/AM3/AM3+.

Thermaltake Riing Silent 12 Pro coolers are able to cool down CPUs with the maximal TDP of 170 W. Their framework consists of 6 nickel-plated copper heatpipes, a voluminous heatsink with aluminum fins as well as a single 120-mm fan. The latter is based on hydraulic bearing, estimated for 40.000 hours of foolproof operation.

The included fan might rotate within the range from 500 to 1400 RPM. Its blades are sure to provide for up to 53 CFM airflow at up to 19 dB noise. The connection of a fan is realized via a 4-pin connector. Furthermore, the user is free to employ an additional LNC adapter which reduces fan rotational range (300-700 RPM) and …

Intel Makes an Agreement with ASML to Accelerate 450 mm Wafer Development

The past several days were marked by the Intel's announcement about the celebration of a contract with ASML company. Such step has been dictated by the company's intentions to invest into the development of 450 mm wafers and EUV technologies. In accordance with the preliminary estimates, the general investment rate will reach $4.1 billion. The major target of the cooperation is to decrease the term of lithography equipment commissioning by two years, and stimulate the development of technologies targeted at 450 mm wafers. The implementation of the predesigned plans will allow the manufacturers of semiconductor components to receive a range of benefits, among which is the cut of expenses.

With the purpose to facilitate in the solution of this technological problem, Intel will take part in a dedicated program. This program includes financial backup of scientific and research projects, as well as, equity investing campaigns in ASML.

The initial stage of this program …
Get computer-assisted driver search with our brand utility *
* The Utility requires installation. Upon installation and running DevID Agent will detect
which devices require drivers and which drivers require updates.
The Utility doesn't contain viruses or malicious code
Registered at: 20 March 2011, 18:08
Last visit: 20 March 2011, 18:08