Motherboard Gigabyte GA-F2A85X-UP4 Review

The second generation of AMD A-Series hybrid processors, announced earlier in October, are already integrated in a number of graphics solutions. The newly appeared products are compatible with Socket FM2 only and cannot be applied for Socket FM1 infrastructure. This implies that a number of motherboards lose their upgrade facilities and can't be updated with a new advanced solution. Still, the market is currently ready to present a few boards destined to operate with the updated AMD A-Series. Gigabyte is one of the pioneers in this respect, introducing its motherboard GA-F2A85X-UP4, developed specifically for Socket FM2.


Gigabyte GA-F2A85X-UP4 is designed in ATX form-factor with 305x244 mm PCB dimensions. AMD A85X chipset is a heart of the motherboard; it secures the compatibility with A-Series (second gen.) APU and Athlon CPUs in the implementation of Socket FM2. The overall TDP level claimed for the model is not more than 100W. The PCB allots four DIMM slots …

SilverStone Heligon HE01 - a new super-cooler

The Taiwanese company introduced a bulky cooler SilverStone Heligon HE01, which is designed to cool down more or less all types of modern CPUs — from Intel LGA775 up to LGA2011 and from AMD AM2 to AMD AM3 + / FM2.

The construction does not weigh less than 1.1 kg, since in addition to two-part radiator (926 g) it is equipped with fan of 140x140x38 mm size. Linear dimensions of Heligon HE01 are 140 mm in width, 119 mm in length and 160 mm in height. Staples that hold the fan, take a few millimetres of space.

The thickness of a pair of «towers», joined by six nickel-plated copper heat pipes with a diameter of 6 mm, is uneven. The intense air flow passes successively through a thin array of aluminium fins, and then through the fan, afterwards through a larger section of the radiator. Copper base with nickel cover is protected with a film from scratches.

The manufacturer claims that Heligon HE01 will cope with the withdrawal of 300 watts of heating power.

Regular …

AMD Highlights Plans for the Transition to the 28nm Process

AMD is a company known for the continual and elaborate work on the development and improvement of all product lines, as well as technological standards. Thus, the coming 2013 year is supposed to be portentous for the company in terms of the implementation of 28nm standards in their APU. AMD has recently voiced the plans for the change of the Trinity APU to a new model, codenamed Richland, and the transition to 28nm technological process.

The new APU, Richland, is presumably to be released in two versions: dual-core and quad-core. It will support a number of high-performance technologies, such as Blu-ray 3D, dual graphics, Open CL, AMD turbo core overclocking, and some others.

According to the preliminary information, Richland will employ FM2 socket (which Trinity employs) and Radeon 8000 series DirextX 11 GPU. This GPU will be furnished with 128 cores in dual-core model line, and with 384 cores in the high-end A10 APU. The same number of cores has been implemented in …
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Registered at: 27 May 2012, 20:49
Last visit: 27 May 2012, 20:49