PC-Cooling Releases a New Chassis under Cooltek Brand

All those people who look for a small-sized and classic chassis for HTPC system have got a wonderful opportunity to implement their longing into life. PC-Cooling GmbH has introduced its new PC case, codenamed Coolcube, under Cooltek brand. Such an engaging name totally corresponds to the case's framework: cubic case made of anodized aluminum and painted black. Featuring 210x200x240 mm dimensions, the product is estimated for the installation of mini-ITX motherboards. The case itself contains a large number of ventilation holes in the side and rear parts.

The number of PCI expansion slots equals to two, but there is no a dedicated bay for 5.25-inch drives. However, there is room for the installation of a single 3.5-inch drive and one 2.5-inch drive. The length of supported graphics cards should not exceed 185 mm, while the height of supported CPU coolers should not exceed 80 mm.

The most striking thing is that this chassis model is compatible with the majority power supply …

HGST Announces Corporate-Class Ultrastar C10K1800 Hard Drives

Despite the emergence of ultra-fast and voluminous SSD devices, data processing centers still require classical storage solutions. Hence, HGST, an affiliate company of Western Digital, decided to comply with the corporate demands by introducing budgetary hard drives entitled Ultrastar C10K1800. The new-comers are targeting exactly DPC-systems which are in need of high performance combined with fail-safe behavior.

HGST Ultrastar C10K1800 drives feature 2.5-inch form-factor and come in diverse capacity variations (from 300 GB to 1.8 TB). The models employ SAS interface with 12 Gb/sec throughput. It should be noted that designers involved the minimal amount of plates on the maximal possible tape density. The latter are thought to rotate with 10.520 RPM.

The implementation of only few plates provides for the reduction of power consumption; this is supposed to be a great benefit since the drives are estimated for a durable 24/7 operation. Thus, an average power consumption …

Intel Broadwell CPUs will Get BGA Casing

The Internet community is energetically discussing unofficial info concerning the future Intel's Broadwell processors. According to the yet unacknowledged data, Intel will branch off from currently traditional LGA casings in favor to a more advanced BGA solution. At present all CPUs designed by Intel specifically for desktop platforms feature LGA (Land Grid Array) casings which allow the users to upgrade their systems without any hassle. On LGA implementation, the chip is housed within a socket and contacts with the motherboard. As a result, the user might change one chip to the other only with similar set of contacts.

The launch of Intel Broadwell processors, which is planned for 2014, might dramatically change the situation for customers. Most probably Intel will refuse from LGA casings and accommodate all new CPUs in BGA ones, marking the change of Haswell generation to the future Broadwell generation developed under 14 nm technological process. BGA (Ball Grid Array) …
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Registered at: 24 September 2012, 13:42
Last visit: 24 September 2012, 13:52