New CPU Cooler for Small-Sized PCs from Thermalright

Thermalright boasts the release of a new CPU cooler AXP-100. The new arrival is targeting small-sized PC systems, featuring 121x105.5x58 mm dimensions. Similar to other items that take responsibility for proper CPU cooling, this model is able to provide an efficient heat extraction from processor surface and its surrounding crucial components. It is compatible with the majority of AMD and Intel sockets to guarantee its universal utilization. Hence, it supports AMD FM1, FM2, AM2, AM2+, AM3, AM3+, and Intel LGA (2011, 1366, 1156, 1155, 775) platforms.

Thermalright decided not to apply the so popular nowadays 'direct contact' technology, implying the direct contact of CPU cover with heat pipes. Instead, the cooler's framework has been given a bit different approach.

Model AXP-100 consists of a copper, nickel-plated base, six copper heat pipes, a set of aluminum ribs located parallel to the motherboard, and an atypical in its nature fan TY-100. The heatpipes spring from the …

Aresze Announces Chassis with Noiseless Cooling System

Enthusiasts and gamers might sigh with relief after their prolonged attempts to find the chassis for the creation of high-performance gaming systems. Aresze is going to release chassis, codenamed Seediq 8003, of new generation which is a perfect match for high-end gaming systems with unique cooling facilities. The chassis is developed in midi-tower form factor and features 520x215x508 mm dimensions. The casing is made of steel alloy, and is ready to accommodate motherboards of micro-ATX and ATX standards.

Despite the average dimensions, Aresze Seediq 8003 is compatible with CPU fans of 175 mm in height, large graphics adapters of up to 300 mm in length with HDD bays and up to 430 mm – without HDD bays, as well as, power supply units of ATX/EPS standard. This chassis has got quite efficient internal layout. Hence, it's equipped with ten sections for drives (four external 5.25 inch drives and six internal 2.5- 3.5 inch drives) and eight PCI slots for four graphics adapters.
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Next year TSMC will start manufacturing the first 20nm chips

The Taiwanese company TSMC confirmed its intention to start production of chips using 20 nm technological processes in 2013. However, for now the company does not plan its production on an industrial scale and will release the first chips in a limited quantities, giving them a total of 1% of production capacity. According to the head of the company, the mass production of semiconductor chips with this technology will not begin until 2014.

Meanwhile TSMC Company is going to produce only one version of the chip, which will be able to enter into the wide range of devices, from smart phones with low-power to high-performance graphics cards. For comparison, the Taiwanese company currently has four different output chips on 28-nm technology. These are 28LP (poly / SiON) for low-power low-cost chips, 28HPL (HKMG) for use in low power applications, 28HP (HKMG) for high-performance chips and 28HPM (HKMG). The latest version combines elements of high-performance chips with high efficiency …
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Registered at: 26 July 2012, 17:41
Last visit: 26 July 2012, 17:41