Review of Android-Smartphone Highscreen Yummy Duo

The majority of smartphone developers resort to the unexpected design, functional and accessories solutions when it goes about rivalry and pursuit for the customers and recognition. Highscreen company tries to maintain its reputation and to exceed the competitors by introducing innovative smartphone solutions, among which is Android-communicator Highscreen Yummy Duo. This device enables the work with 2 SIM-cards simultaneously, and this fact allowed the smartphone to enter the line of top products and represent the highly-promising niche in the market.



Design and Controls Localization


Smartphone Highscreen Yummy Duo is of large-scale dimensions that can’t but strike the customers’ eyes. Its dimensions are conditioned by the availability of a large screen of 4.3 inches which takes nearly the entire faceplate of the casing. This smartphone is not distinguished by the thickness of casing despite the possibility to integrate 2 SIM cards; in fact, the casing thickness does …

ECS Intros a Series of H81 Motherboards with Durathon Support

ECS proudly introduces a series of new motherboards, based on Intel H81 Express chipset. The series consists of three models (H81H3-A3, H81H3-M7, H81H3-I) that support Socket LGA1150 platform and are ready to work with Intel Haswell processors. All three products are developed in different form-factors: standard ATX, microATX and mini-ITX. Therefore, the users have got a chance to choose which item is more appropriate for the assembling of systems with various performance requirements.



Despite the fact that the new-comers position themselves as entry-level solutions, ECS has taken care of their reliability and stability of operation. Therein, it incorporated Durathon technology, which is responsible for the products’ eligible work during a long period of time. Durathon implies the employment of a PCB with high density in order to protect the components from the detrimental effect of moisture, the replacement of standard capacitors to solid-state analogues with prolonged …

Thermalright Unveils a Colossal HR-22 CPU Heatsinks

Thermalright, a top-ranked Taiwanese developer of cooling solutions, has recently unveiled its newest CPU heatsink, entitled HR-22. The new-comer features 120x150x159 mm dimensions and is peculiar by nearly ‘colossal’ cooling effect. The HR-22 is targeting all up-dated platforms with Intel LGA2011/LGA1366/LGA115x and AMD FM1/FM2/AM3/AM3+ sockets. The company promises to start the sales in the nearest future, though pricing is still unknown.



Thermalright HR-22 boasts a tower-like framework, consisting of a copper base, thirty-five aluminum plates, and eight nickel-plated heatpipes (6 mm each). The only hexagonal notch in the center is thought to simplify the heatsink installation.


All the plates contain rectangular holes that facilitate the airflow when used in passive mode. Such peculiarity is called Direct Passive Airflow System (DPAS). It not only provides for an efficient cooling and unimpeded airflow, it saves the users’ ears from noise: a powerful heatsink is …
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Registered at: 17 March 2011, 13:02
Last visit: 18 March 2011, 08:02