Top-Tier Chassis Zalman H1 Review

Zalman has long been deprived of a full-tower flagship PC chassis, after it discontinued the line of GS1200. The anticipation of a new etalon was accompanied by an overall market uncertainty as for the future of desktop platforms. Luckily, laptops and tablets couldn’t fully satisfy the customers’ growing needs, so Zalman decided to fire off with a new top-tier case, entitled H1. Stylish and magnetic from outside, this model has a lot of interesting options in the bins. Let’s have a look at them.



Key Features


Zalman H1 is a full-tower case, featuring 561x238x570 mm dimensions. The chassis is made of steel, aluminum and a high-quality plastic, with exterior and interior totally painted black. Internal layout allows for the installation of motherboards with elongated PCBs, including E-ATX and XL-ATX models. The model houses three external bays for 5.25-inch drives, seven internal bays for 2.5-/3.5-inch drives as well as nine expansion slots.


The case boasts some …

Intel Unveils DZ75ML-45K Board with LucidLogix Virtu MVP Support

CES 2013 provided room for Intel to show all its might and recent achievements in PC hardware industry. Hence, the company unveiled a series of new motherboards intended at the overclocking of Intel Core i3, i5, and i7 CPUs of the second and third generation. Model, codenamed Intel DZ75ML-45K, is a bright representative of this series, being a large-scale entry-level solution. It is developed in micro-ATX form-factor and features 226x216 mm dimensions.



Motherboard Intel DZ75ML-45K is based on Intel Z75 chipset and employs Socket LGA1155 CPU slot. Power supply subsystem is designed according to 4+2 scheme, where 4 phases are responsible for CPU management. The board accommodates four DIMM slots for the integration of two-channel DDR3 RAM; its overall capacity might achieve 32GB. Besides, Intel has taken care about wide memory facilities that manifest themselves is various operational frequencies (from 1066 MHz to 2400 (OC) MHz).


All expansion facilities are provided by …

Micron to Carry Out the Production of TLC Memory Next Year

Memory market, similar to other industries, undergoes certain changes and updates from time to time. Therefore, memory manufacturers are currently trying to comply their production with two major tendencies: considerable drop in demand for RAM, employed basically in desktop PCs, and simultaneous growth of demand for solid-state drives, employed in compact tablets and mobile devices. Besides, the latter is developed at lightning speed.



Micron, one of the leading memory manufacturers, feels like no one else all the changes and fluctuations in the market. Its quarterly reports witness about the relentless drop in demand for DRAM (9% drop at average) for the report period. At the same time, increase in SSD segment is estimated at 5% at average. Sales volume of NOR memory type did not outlive serious changes.


According to the preliminary data, Micron is going to carry out the production of memory on TLC microchips, manufactured under 20 nm technological process. The assumed …
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Registered at: 09 June 2011, 21:30
Last visit: 09 June 2011, 21:30