Intel Makes an Agreement with ASML to Accelerate 450 mm Wafer Development

The past several days were marked by the Intel's announcement about the celebration of a contract with ASML company. Such step has been dictated by the company's intentions to invest into the development of 450 mm wafers and EUV technologies. In accordance with the preliminary estimates, the general investment rate will reach $4.1 billion. The major target of the cooperation is to decrease the term of lithography equipment commissioning by two years, and stimulate the development of technologies targeted at 450 mm wafers. The implementation of the predesigned plans will allow the manufacturers of semiconductor components to receive a range of benefits, among which is the cut of expenses.

With the purpose to facilitate in the solution of this technological problem, Intel will take part in a dedicated program. This program includes financial backup of scientific and research projects, as well as, equity investing campaigns in ASML.

The initial stage of this program …

ASRock Launches Z170M-PIO2 Mainboard with Unusual Layout

ASRock has stricken the general public by the development of a motherboard with an extraordinary layout. As a rule, mainboards targeting all-in-one solutions are void of expansion slots for graphics cards, due to lack of space. However, ASRock has designed a space-efficient model with an integrated PCI Express 3.0 x16 slot. Yet, it’s localized parallel to the PCB as against standard items with perpendicular slot orientation.

ASRock Z170M-PIO2 is based on Intel Z170 chipset for Socket LGA1511 platforms. It supports Intel Celeron/Pentium/Core i3/Core i5/Core i7 CPUs. The PCB features a pair of DIMM slots for the installation of DDR4 memory modules with the maximum clock frequency of 3466 MHz (up to 32 GB of capacity). Storage subsystem is introduced by 4 SATA 6 Gb/sec ports as well as a single Ultra M.2 x4 slot.

As far as expansion is concerned, the model accommodates a single PCIe 3.0 x 16 slot and one M.2 2230 slot, occupied by Wi-Fi/Bluetooth adapter. The 7.1-channel …

Meet New Landking Mid-Tower Chassis from Deepcool

Deepcool, known initially as the provider of prime-class cooling solutions, decided to gladden its fan audience by the release of a new mid-tower case, entitled Landking. The new-comer is targeting ATX, mini-ITX and micro-ATX mainboards, expansion cards of up to 280 mm in length, and CPU coolers of up to 165 mm in height. The chassis is made of steel with plastic inclusions, differentiated by a stylish silver coloring.

Deepcool Landking features 512x218x515 mm dimensions and weighs 6.67 kg. Its internal layout is sufficient for the installation of eight expansion cards, three 5.25-inch drives, five 3.5-inch drives, and a pair of 2.5-inch drives. The frontal I/O panel offers two USB 3.0 ports as well as two 3.5 mm mini-jacks; they are accompanied by two USB 2.0 ports and a dedicated dock for SATA interface.

To continue, the chassis offers nice opportunities for the organization of a highly-efficient cooling system. Hence, it accommodates four vacancies for the installation …
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Registered at: 11 March 2011, 14:25
Last visit: 11 March 2011, 14:25