FSP Intros ‘Noiseless’ PSU Model Aurum Xilenser 500

FSP, a renowned developer and supplier of power supply units, introduces a new product that is widely recognized as ‘noiseless’ PSU. Codenamed FSP Aurum Xilenser 500 (AU-500FLD), it employs a passive cooling system instead of an air cooler, thus its dump operation is easily explainable. The unit also characterizes by a startling efficiency which provided for the acceptance of 80+ Gold certificate.



Aurum Xilenser 500 takes similar to Aurum Pro/CM models design with a totally black casing and a comb-like top grid enclosed in a golden stripe. The model is able to operate at the nominal 500W power and support the latest ATX12V/EPS12V standards. It should be noted that this unit utilizes a standard framework with all power connectors soldered on the printed circuit board. A set of connectors involves five SATA connectors, a single 4-contact FDD, four 4-contact Molex, and a pair of 6+2-contact PCI Express connectors. Naturally, it contains two main 24-contact and 4+4-contact …

Biostar Outs a Triple of Racing Motherboards

Biostar has begun the 2016 year’s history with the launch of a new series of motherboards, entitled Racing. Currently, the lineup includes three ATX models — Z170GT7, H170GT3 & B150GT5 — based on Intel Z170, H170 and B150 chipsets respectively. The triple is compatible with Intel Skylake processors for Socket LGA1151.



Biostar Racing motherboards are developed according to Super 5 Design template. It entails a number of advantages. Among them:

— Super Sound – the employment of a high-quality audio subsystem Biostar Hi-Fi audio;

— Super Face – a unique visual styling of the PCB;

— Super Easy – the implementation of a well-considered hardware layout;

— Super Power – the usage of a reliable power subsystem with super durable ferrite and solid-state capacitors;

— Super Fun – the introduction of additional components for more sophistication (i.e. LED backlight).


Biostar Z170GT7 comes with 4 DIMM slots targeting DDR4-3200 MHz memory …

Qualcomm to Enter Into Contract with GlobalFoundries

Qualcomm, a world-known provider of chips for mobile gadgets, has entered into a contract with GlobalFoundries company with the intention to develop chips based on 28 nm technology. Such information has been voiced by an authoritative Chinese publication Commercial Times, referring to the reliable sources. It is presupposed that the manufacturer will start the first dispatches for Qualcomm in the end of this year. The previously voiced data claimed that Qualcomm had arranged orders of 28 nm chips from UMC with the similar dispatch dates.



The estimated reason for the cooperation with GlobalFoundries is the insufficient delivery of 28 nm chips by TSMC. Moreover, Nvidia is supposedly targeting at the cooperation with one more manufacturer except for the TSMC as well. It should be mentioned that the preliminary memorandum between Qualcomm and GlobalFoundries was concluded in 2010; according to this memorandum, the designer got the access towards 45 nm LP and 28 nm LP technological …
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Registered at: 16 January 2012, 20:14
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