The Debut of Cooler Master MasterLiquid Pro 140 and 280 CPU Liquid-Cooling Systems

This year the Cooler Master company has released a series of original MasterLiquid Pro liquid-cooling systems for Intel and AMD CPUs. The models with 120 mm and 240 mm heat sinks were the first to be released. Now it’s the turn of MasterLiquid Pro 140 and 280 devices, using the liquid-cooling systems heat sinks of the suitable size.



These novelties with a “one-piece” and “two-piece” heat sinks have much in common, though they differ in heat spreader dimensions (171 × 138 × 27 mm and 311 × 138 × 27 mm), as well as in the location of the 140 mm fans pair. MasterLiquid Pro 140 has them mounted on both sides of the heat dissipator and MasterLiquid Pro 280 — on the one side only.


Coolers consist of the big water unit with the inbuilt pump, pipes made out of fluorated ethylene-propylene copolymer in braided cable, the aluminum heat sink and fans with a high static pressure rate (up to 3.15 mm H2O).


The water unit base is manufactured out of copper. Inside of …

Thecus Showcases N7710-G and N8810U-G NAS Models

Thecus has gladdened all PC enthusiasts by announcing two new NAS servers, codenamed N7710-G and N8810U-G. Both models are a combination of high efficiency, well-tried network platform for SMB, high-quality hardware base, and appropriate support software. The manufacturer promises to make them available in late March at the price tag of $1335 for the first model and $2400 for the second one.



The N7710-G and N8810U-G are equipped with a powerful Intel Pentium G850 processor, as well as with dedicated network modules that support 10GbE technology. The latter ensures 10 times faster transfer speeds than usual gigabit connection does. Therefore, both storages can efficiently handle all present-day tasks and are sure to handle even more hard-driving ones in the future.


The couple supports all updated RAID configurations (JBOD, 0, 1, 5, 6, 10), which allow the customer to select the most efficient storage options. Additionally, the models support RAID 50 that enables the …

Next year TSMC will start manufacturing the first 20nm chips

The Taiwanese company TSMC confirmed its intention to start production of chips using 20 nm technological processes in 2013. However, for now the company does not plan its production on an industrial scale and will release the first chips in a limited quantities, giving them a total of 1% of production capacity. According to the head of the company, the mass production of semiconductor chips with this technology will not begin until 2014.



Meanwhile TSMC Company is going to produce only one version of the chip, which will be able to enter into the wide range of devices, from smart phones with low-power to high-performance graphics cards. For comparison, the Taiwanese company currently has four different output chips on 28-nm technology. These are 28LP (poly / SiON) for low-power low-cost chips, 28HPL (HKMG) for use in low power applications, 28HP (HKMG) for high-performance chips and 28HPM (HKMG). The latest version combines elements of high-performance chips with high efficiency …
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