Biostar Intros a New Affordable Motherboard Hi-Fi A75S3

Biostar starts the sale campaign of its new motherboard model codenamed Hi-Fi A75S3, which belongs to PURO Hi-Fi flagship line. It is developed in micro-ATX form-factor and is based on AMD A75 system logics. The board supports all contemporary AMD CPUs that are compatible with FM2 socket, including the series A10, A8, A6, E2, A4, and Athlon II X4 (all with TDP level not more than 100W). The new model is targeted to operate under Windows OS (versions XP, 7, Vista and 8).

Motherboard Hi-Fi A75S3 houses two DIMM slots for a two-channel DDR3 memory that is estimated to work at 800MHz, 1066MHz, 1333MHz, 1600MHz, and 1866 MHz frequency. The overall volume of the integrated memory might achieve 32GB. The model employs GPU of Direct X11 class that secures efficient performance in the majority of updated 3D games and applications. Still, the manufacturer reserves the right to enhance the performance of graphics subsystem thanks to the implementation of a single PCI Express 2.0 x16 slot …

Low-Profile SilverStone Argon AR06 Cooler Review

Each manufacturer which deals with CPU coolers tries to enrich its portfolio with products of various segments. SilverStone has gone ahead in this aspect, offering as entry-level so top-notch coolers. The AR06, a representative of Argon Series, is a low-profile model targeting entry-level and mainstream PC systems. Why giving preference exactly to this model? Let’s find it out.


SilverStone AR06 features the following specifications:

— type: air cooler with active airflow;

— compatibility with motherboards: Socket Intel LGA115x, Socket AMD FM1, FM2, AM2, AM3;

— cooling performance: 95 W TDP;

— fan specs: dimensions: 92x92x15 mm, voltage – 12 V, rotational speed – 1200-2500 RPM, airflow – 68.3 m3/h, noise level – 20-28.3 dBA, bearing type – rifle, MTBF – 40.000 hours;

— heatsink specs: dimensions: 58x105x92 mm; weight – 263 mm, aluminum fins, 4x copper heatpipes, direct CPU contact;

— power supply: 4-pin connector;

Qualcomm to Enter Into Contract with GlobalFoundries

Qualcomm, a world-known provider of chips for mobile gadgets, has entered into a contract with GlobalFoundries company with the intention to develop chips based on 28 nm technology. Such information has been voiced by an authoritative Chinese publication Commercial Times, referring to the reliable sources. It is presupposed that the manufacturer will start the first dispatches for Qualcomm in the end of this year. The previously voiced data claimed that Qualcomm had arranged orders of 28 nm chips from UMC with the similar dispatch dates.

The estimated reason for the cooperation with GlobalFoundries is the insufficient delivery of 28 nm chips by TSMC. Moreover, Nvidia is supposedly targeting at the cooperation with one more manufacturer except for the TSMC as well. It should be mentioned that the preliminary memorandum between Qualcomm and GlobalFoundries was concluded in 2010; according to this memorandum, the designer got the access towards 45 nm LP and 28 nm LP technological …
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Registered at: 01 April 2012, 06:21
Last visit: 01 April 2012, 07:41