Lian Li to Combine Performance with Compact Size

Chassis of Full-Tower form-factor usually have solid framework due to the layout scheme and the necessity to enclose a lot of components. Developers from Lian Li company have totally demolished the current tendencies and announced the release of their PC-V750 Full-Tower model with the front-end PSU localization. This allowed the designers to dramatically decrement the size of the chassis without sacrificing its capacity and general specifications. The compact size of the chassis is considered to be a kind of ‘revolution’ in the market, since it is compatible not only with ATX and microATX motherboards, but also with Extended-ATX boards.



Lian Li PC-V750 casing is made of aluminum and approximates 7.35 kg in weight. Its dimensions provide for the installation of massive CPU-coolers (up to 170 mm in height), up to ten expansion cards, including 380 mm 3D cards. The chassis is equipped with five fans of 120 mm each: the two fans are located on the front plate, the other two – …

The SilverStone FPS01 Device Returns the Optical Drive Bay into Game

Optical carriers are not popular anymore. Nowadays they are mostly used as license movies carriers, and not as user data storage media. SilverStone offers an alternate variant for those having an unexploitable optical drive of the Slim type.



The new device, called FPS01, is released in two variants, which differ in USB types only: the SST-FPS01 model offers a pair of standard А type ports, and SST-FPS01-C possesses only one С type port. FPS01 is compatible with the standard 12.7 mm Slim ODD optical drive bay and is installed in place of the needless DVD or Blu-ray bay. Though this is not the whole scope of the module’s functionality.


This device features the built-in SD and microSD card reader supporting SDHC and SDXC cards, and the place to install M.2 drive with 6 Gbps SATA interface of 2280 typical size. Unfortunately, the use of FPS01 in laptops can bring some trouble as far as there’s a need to connect the module through standard Molex jacks, USB 3.0 and SATA. …

Intel Makes an Agreement with ASML to Accelerate 450 mm Wafer Development

The past several days were marked by the Intel's announcement about the celebration of a contract with ASML company. Such step has been dictated by the company's intentions to invest into the development of 450 mm wafers and EUV technologies. In accordance with the preliminary estimates, the general investment rate will reach $4.1 billion. The major target of the cooperation is to decrease the term of lithography equipment commissioning by two years, and stimulate the development of technologies targeted at 450 mm wafers. The implementation of the predesigned plans will allow the manufacturers of semiconductor components to receive a range of benefits, among which is the cut of expenses.



With the purpose to facilitate in the solution of this technological problem, Intel will take part in a dedicated program. This program includes financial backup of scientific and research projects, as well as, equity investing campaigns in ASML.


The initial stage of this program …
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