Next year TSMC will start manufacturing the first 20nm chips

The Taiwanese company TSMC confirmed its intention to start production of chips using 20 nm technological processes in 2013. However, for now the company does not plan its production on an industrial scale and will release the first chips in a limited quantities, giving them a total of 1% of production capacity. According to the head of the company, the mass production of semiconductor chips with this technology will not begin until 2014.



Meanwhile TSMC Company is going to produce only one version of the chip, which will be able to enter into the wide range of devices, from smart phones with low-power to high-performance graphics cards. For comparison, the Taiwanese company currently has four different output chips on 28-nm technology. These are 28LP (poly / SiON) for low-power low-cost chips, 28HPL (HKMG) for use in low power applications, 28HP (HKMG) for high-performance chips and 28HPM (HKMG). The latest version combines elements of high-performance chips with high efficiency …

Motherboard ASRock Z77 OC Formula Review

The variety of motherboards designed by ASRock is able to satisfy the whims of any customer group. All models are characterized by multiple useful facilities and different price ranges. This makes ASRock products a universal means for PC integration. These days the company has proudly released a dedicated motherboard, codenamed Z77 OC Formula, developed specifically for overclockers. This is the first model of this manufacturer designed particularly with overclocking facilities in mind.



Design and Integration


At first sight, motherboard ASRock Z77 OC Formula does not distinguish itself by exceptional design and layout. However, more intense look will uncover a range of peculiarities pertained specifically to this product. This motherboard is designed in CEB form-factor, since the number of integrated facilities would be scant for ATX standard. Still, fixing holes are located similarly to ATX boards, so there won't be any difficulties during its installation.


It should …

New RAM Modules Ballistix Sport SODIMM from Lexar Media



Lexar Media, a well-known American designer of diverse digital media products, starts selling its new RAM series from Ballistix line. Entitled Sport SODIMM, the series is introduced by four SODIMM-DDR3 modules, intended for the incorporation into gaming laptops: BLS4G3N169ES4, BLS8G3N169ES4, BLS4G3N18AES4, and BLS8G3N18AES4. The quadruple is distinguished by an original design with the implementation of unique heatspreaders. All of them are optimized for Intel Core i5/i7 mobile processors of the fourth generation (Intel Haswell platform) and support all up-dated XMP profiles.


The most beneficial feature applied to Ballistix Sport SODIMM modules is their power-saving nature. They are able to operate at 10% lower power voltage than analogous products; hence, they reduce the laptop’s power consumption index and increase the time of its offline work.


To continue, the first two models, BLS4G3N169ES4 and BLS8G3N169ES4, come in 4 GB and 8 GB capacities correspondingly. They …
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