Ultrathin 2.5-inch SSDs from Biwin

Biwin America, Inc., a global manufacturer of solid-state drive solutions for client and corporate needs, has officially announced the release of 2.5-inch SSDs with slim-profile casings. It should be mentioned that decrease in casing dimensions touched upon all 2.5-inch products and series manufactured by the company, including Smart, Pro and Elite Series with SATA 3 and SATA 2 interfaces, as well as Drive NX and NuvoDrive PX Series with SATA 3 interfaces.

Previously all SSDs were developed in 9.5 mm-thin casings, but the current modifications allowed Biwin to decrease the dimensions to 7 mm. This is twenty-six percent less than with preceding models. Hence, slim-profile SSDs are applicable in more compact devices; they are destined to be installed in 1U and 2U server stands. This is called to increase the deployment capacity of the server without sufficient investments. Biwin 7 mm SSDs casings are made of black anodized aluminum to ensure fail-proof characteristics of the …

Transcend to Announce a SuperSpeed USB 3.0 SSD

Transcend Information, a leading designer of storage solutions, announces the launch of its new super high-speed SSD, codenamed ESD200. The drive employs the latest USB 3.0 interface of SuperSpeed generation and is distinguished by truly compact dimensions, providing for the most convenient utilization. The casing is void of movable parts and operates with minimum noise level. Besides, it's based on a set of flash chips and owns anti-heat, shockproof and anti-vibratory properties. The series will be introduced by models of 128GB and 256GB volume capacity.

The implementation of SuperSpeed USB 3.0 interface ensures ten times faster data transfer speed, if compared with the previous USB 2.0 generation. On such conditions, Transcend ESD200 is capable to develop Read speed up to 260 Mb/sec and Write speed up to 225 Mb/sec. This implies that 4.7GB DVD drive full of different content will be copied for fifteen seconds only. However, a new SSD is backwards compatible with USB 2.0; so, …

Meeting New Gaming Memory Kits AMD Radeon RG2133

A couple of days ago AMD introduced a new series of DDR3 memory kits within the boundaries of AMD Unified Gaming Strategy development. Codenamed AMD Radeon RG2133, the new-comers are available in two- and four-channel kits, the overall capacity of which equals to 16 GB and 32 GB correspondingly. The most striking feature is that they can be employed as on AMD, so on Intel platforms, supporting AMD AMP and Intel XMP technologies for improved settings optimization.

The other peculiarity is that these memory kits run at 2133 MHz frequency. On such conditions there is always a chance to dramatically increase the system performance up to 22% (with APU AMD A10 on board). Herewith, voltage index equals to 1.65 V, while latency index looks the following way: 10-11-11-30. Memory chips are cooled down by the forces of a high-quality aluminum heatspreader. Its design is called to ensure a stable operation in response to the increased frequencies.

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Registered at: 21 March 2011, 07:23
Last visit: 21 March 2011, 07:23