Thermaltake Enters the Market with NiC L31 and L32 CPU Coolers

Thermaltake Technology has just started shipping a pair of budgetary CPU coolers from NiC series. Entitled NiC L31 and NiC L32, these two models are compatible with all updated Intel and AMD platform motherboards. In keeping with the manufacturer, the new-comers will not obstruct the mounting of memory modules, due to their well-considered framework. Hence, they consist of small-sized heatsinks, three U-shape heatpipes (8 mm), and a base that is in direct contact with the CPU.



The first model, NiC L31 (codename: CL-P001-AL12RE-A), features 140x128x40 mm dimensions and weighs 530 g. The integrated 120 mm fan might operate in various speed modes – from 500 RPM to 1800 RPM – thanks to the support for PWM technology. It produces up to 70.99 CFM and dissipates up to 160 W power.


At the same time, at the minimal speed mode it generates only 18 dB noise, however at the ultimate rotations this index rises to 34.8 dB. According to the results of multiple tests, this fan is …

NVIDIA to Increase Graphic Performance in Mobile Devices

All new devices that appear in IT market are treated with great attention from the part of contemporary customers. All functional characteristics, design and other possibilities are considered in details. Graphics isn’t exclusion and is always under intent look of users and IT experts. Computer and game console graphics went over the line of unnatural imaging long time ago and became a genuine embodiment of real life. Nowadays it is not a problem for the gamer to totally plunge into the world of fantasy or battle-front since the graphics presents data with real authenticity.



NVIDIA, the world-known developer of discrete graphic chipsets for personal computers and mobile devices, strides confidently in the direction of graphics performance improvement. Company specialists are currently working at the perfection of graphics performance on mobile devices and game consoles. IT analysts dare to assume that functional characteristics of graphic core sets on mobile devices will catch …

Intel Makes an Agreement with ASML to Accelerate 450 mm Wafer Development

The past several days were marked by the Intel's announcement about the celebration of a contract with ASML company. Such step has been dictated by the company's intentions to invest into the development of 450 mm wafers and EUV technologies. In accordance with the preliminary estimates, the general investment rate will reach $4.1 billion. The major target of the cooperation is to decrease the term of lithography equipment commissioning by two years, and stimulate the development of technologies targeted at 450 mm wafers. The implementation of the predesigned plans will allow the manufacturers of semiconductor components to receive a range of benefits, among which is the cut of expenses.



With the purpose to facilitate in the solution of this technological problem, Intel will take part in a dedicated program. This program includes financial backup of scientific and research projects, as well as, equity investing campaigns in ASML.


The initial stage of this program …
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