ASRock Unveils Z170M OC Formula Mainboard

ASRock came into the market with a new small-sized overclocking-oriented mainboard. Entitled Z170M OC Formula, the model is designed in micro-ATX form-factor on the basis of Intel Z170 chipset. The latter is ready to cooperate with Intel Skylake CPUs for Socket LGA1151. The PCB offers a pair of DIMM slots for DDR4-4500 MHz RAM (up to 32 GB capacity).

ASRock Z170M OC Formula accommodates three PCIe 3.0 x16 expansion slots, enabling the creation of various graphics configurations (including Nvidia SLI & AMD CrossFireX). Storage subsystem is introduced by a pair of SATA Express ports (10 Gb/sec) as well as four SATA ports (6 Gb/sec) and one Ultra M.2 slot (32 Gb/sec).

This motherboard boasts a high-quality audio subsystem; it is based on Realtek ALC1150 controller, generating 7.1-channel sounding (Purity Sound 3). The 10-layer PCB comes with an integrated 14-phase power subsystem with dual-stack MOSFETs, premium choke coils, and solid-state capacitors Nichicon 12K Platinum. …

Spam Modifications and Its Activity Level in 2012

‘Kaspersky Lab’ company, known for the development and distribution of information security programs, has recently published a report dedicated to the spam-system activity for the past quarter of 2012. The report contains the statistical data in percentages about the spammer activity in different parts of the world. The 3% reduction of e-mail spam level is considered to be the most advantageous aspect in the report. However, the extension of the spammer activity geography is considered to be the least advantageous aspect in the whole report. The extension brought to the substantial increase of the Internet trash in separate regions.

The report provided by ‘Kaspersky Lab’ exemplifies the most striking spam samples which were distributed to the targeted groups. Hence, the largest number of spam-messages and add-ons has been distributed during the religious and national festivities. The working scheme of spam messages didn’t change so much and was targeted mainly at the …

Cooler Master to Continue Its Series of Heatsinks with Vapor Chambers

Cooler Master has lately introduced its new lineup of coolers with the implementation of vapor chambers technology (TPC 812 series). However, the company's plans are not limited to this series only, and the upcoming release of V4 GT series is the most convincing proof of it. The new series will be based on horizontal vapor chamber technology and intended at the colling down of high-end graphics cards.

In accordance with the manufacturer's undertakings and plans, the implementation of this technology will provide for the octuple improvement of heat dispersion as compared with the solid copper-contact sink. This approach towards the processor's colling down enables the involvement of more heat pipes. Nevertheless, V4 GT model will be equipped with only four heat pipes.

Vapor chamber technology stipulates efficient removal of heat from the processor and other integral components. At the same time, it averts the creation of hot spots and promotes for the even distribution of …
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Registered at: 03 November 2012, 20:00
Last visit: 03 November 2012, 20:27