Intel Debuts with 5th Gen Core Mobile CPUs

Within the confines of CES 2015, Intel has officially introduced the fifth generation of Intel Core mobile processors. The lineup is targeting traditional laptops, ultrabooks, 2-in-1 devices, chrome-books, all-in-one items as well as mini-PCs. Besides, the company pin hopes for their CPUs to be additionally implemented within ‘All-inclusive Internet/Internet of Things’ embedded device concept.



New processors are designed according to 14-nm Intel Broadwell architecture. Due to the transition to a brand new technological process, the number of transistors has increased by 35%; herewith, the core area has reduced by 37%. Such innovative move provided for the enhancement of efficiency with simultaneous cut of power consumption. As a result, devices with the integrated Intel Core CPUs are called to run 1.5 hours longer in standalone mode.


The 5th generation lineup might boast the support for the latest codecs (HEVC, VP9, VP8), technologies (Intel WiDi 5.1, Intel RealSense …

G.Skill Showcases New RAM Memory Modules TridentX DDR3

Long-awaited Computex 2013 has brought to light the whole galaxy of innovative hardware ideas. RAM market has also replenished with new entries, partially due to G.Skill International. Its new RAM modules, codenamed TridentX DDR3, are an embodiment of utmost performance, reliability and compatibility. The new-comers have been developed to support the latest Intel’s Haswell-based CPUs i3/i5/i7, integrated into Intel Z87 Express chipset.



TridentX DDR3 are introduced by sets of two and four 240-contact DIMM modules, the total capacity of which achieves 8 GB, 16 GB and 32 GB. All of them are equipped with original in design heatspreaders. They are also known to support Intel XMP overclocking profiles and to operate at 1.65 V power voltage.


Detailed Specifications


TridentX DDR3-3000 modules will be available in 4x8 GB kits (32 GB). Their effective frequency showings make up 3000 MHz with 12-14-14-35 latencies.


TridentX DDR3-2933 modules will be available in 2x4 …

Greeting Versa H23 and H23 Window Cases from Thermaltake

Budget-oriented series of PC cases from Thermaltake has been replenished with two new models: Versa H23 and Versa H23 Window. The mere difference between the two enclosures is the availability of a side-faceted acrylic window in ‘Window’ version. Still, both mid-towers feature 429x209x491 mm dimensions and come with a totally black coating. Their internal spacing is sufficient to include standard ATX, as well as contracted micro-ATX motherboards.



Thermaltake Versa H23 and H23 Window boast two 5.25-inch, six 2.5-inch and three 3.5-inch trays for the installation of various drives. All of them might be mounted without any special tools, due to a polished clipping system. The cases offer seven PCI slots to expand the system’s functional.


Additionally, the models support the installation of CPU coolers of up to 156 mm in height, graphics cards of up to 315 mm in length, and a standard PS/2 power supply unit. The I/O panel is located in the top-front panel. It embraces …
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Registered at: 24 September 2011, 17:28
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