Transcend produces memory kits aXeRam DDR3-2400 and DDR3-2133 with 8 GB of memory

The widely represented in the market a series of RAM sets Transcend aXeRam is now added with dual channel kit DDR3 of 8 GB with an effective frequency of 2133 and 2400 MHz. Modules are routinely equipped with aluminum radiators with high «scallops» and support overclocking profiles Intel XMP 1.3, actual for the processors Intel Ivy Bridge.



The package Transcend aXeRam DDR3-2133 2x 4 GB consists of two brackets with a combination of delay of memory 10-11-10-27 and moderate voltage 1.6 V. Overclocking enthusiasts will certainly prefer against it more productive Transcend aXeRam DDR3-2400 for the same amount. Timings have been raised in a given set up to 11-12-11-29, and default voltage — up to 1.65 V.


To increase the stability of the new items, they are made on an 8-layer PCB. Overclocking spirit of the tandem Transcend aXeRam DDR3-2133/2400 emphasizes the possibility of fine tuning by the utility aXeMod. In addition, aXeMod monitors the temperature of the memory.


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Presentation of Workstations and Graphics Servers of ESC Series

Asus has recently presented workstations and graphics servers of the second generation ESC series. The new series includes ESC4000 G2, ESC1000 G2 and ESC2000 G2 models which serve the function of high-end platforms for GPGPU applications in such fields as medical research, financial modeling, computer-aided design, animation and 3D-rendering. The systems can boast a wide spectrum of options and outstanding integration; they are able to support high-end Intel processors and four graphics cards, and are equipped with the efficient PSU and expansion slots PCI Express 3.0x16.



All three models of ESC series are furnished with high-quality PSU which correspond to the 80Plus standard. Thereby, each of the models boasts energy-saving facilities: ESC1000 G2 and ESC2000 G2 go with a single PSU of 80Plus Gold standard in 1350 W capacity; ESC4000 G2 goes with two PSU of 80 Plus Platinum standard in 1620 W capacity (one of them is an emergency unit in case of troubles with the other unit). … …

Intel Broadwell CPUs will Get BGA Casing

The Internet community is energetically discussing unofficial info concerning the future Intel's Broadwell processors. According to the yet unacknowledged data, Intel will branch off from currently traditional LGA casings in favor to a more advanced BGA solution. At present all CPUs designed by Intel specifically for desktop platforms feature LGA (Land Grid Array) casings which allow the users to upgrade their systems without any hassle. On LGA implementation, the chip is housed within a socket and contacts with the motherboard. As a result, the user might change one chip to the other only with similar set of contacts.



The launch of Intel Broadwell processors, which is planned for 2014, might dramatically change the situation for customers. Most probably Intel will refuse from LGA casings and accommodate all new CPUs in BGA ones, marking the change of Haswell generation to the future Broadwell generation developed under 14 nm technological process. BGA (Ball Grid Array) …
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