Chassis Chieftec Libra LF-01B-OP Review

Chieftec is the company that tries to satisfy the needs of any customer, by supplying multifarious PC hardware. Its latest chassis series, codenamed Libra, is primarily aiming at gamers due to its splashy design and elaborated layout. Chassis Libra LF-01B-OP is a senior model in the series that is distinguished by a more distinct gaming directionality: ATX form-factor, bottom-part PSU localization, a line of fans, dock station for hard drives, and some other pleasing facilities.



Design


Chieftec Libra LF-01B-OP is notable by restrained design peculiarities with a bit rounded angles and straight lines. The casing is totally black from the outside and inside with the wee bit dull surfacing. The upper panel is made of plastic; its larger part is taken by a grid that serves a means of hot air blow-out. Closer to its front part, one can find a dock station for 3.5/2.5-inch drives and a recess for peripheral components. Interface panel is introduced by two USB 3.0 ports and the …

Cooler Master Releases GX II Power Supply Units

Unveiled earlier this year, the GX II PSU series from Cooler Master has been officially released. The series, targeted primarily at gamers, consists of five models with the power index of 450 W, 550 W, 650 W, 750 W, and 850 W. All the products feature 150x140x86 mm dimensions and are characterized by a non-detachable cable design. Moreover, all the models without exception boast the awarding of 80 Plus Bronze certificate, due high efficiency level of 85% on load.



Cooler Master GX II power supplies fully support Intel Core (Haswell-based) CPUs with APCF scheme. All the units are equipped with a sole +12V bus and support a range of protection functions, including OVP, UVP and SCP. A set of non-detachable cables varies depending on the power efficiency. There is a core set of sockets, consisting of the main 24-contact ATX and a pair of 4-contact EPS sockets; all other sockets differ from model to model (four 6+2-pin, three Molex, and nine SATA sockets).


The incorporation of …

Intel Makes an Agreement with ASML to Accelerate 450 mm Wafer Development

The past several days were marked by the Intel's announcement about the celebration of a contract with ASML company. Such step has been dictated by the company's intentions to invest into the development of 450 mm wafers and EUV technologies. In accordance with the preliminary estimates, the general investment rate will reach $4.1 billion. The major target of the cooperation is to decrease the term of lithography equipment commissioning by two years, and stimulate the development of technologies targeted at 450 mm wafers. The implementation of the predesigned plans will allow the manufacturers of semiconductor components to receive a range of benefits, among which is the cut of expenses.



With the purpose to facilitate in the solution of this technological problem, Intel will take part in a dedicated program. This program includes financial backup of scientific and research projects, as well as, equity investing campaigns in ASML.


The initial stage of this program …
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Registered at: 05 September 2012, 06:33
Last visit: 05 September 2012, 12:41