QUMO Enters SSD Market with a New High-End Series

QUMO, a Japanese manufacturer of various PC components, decided to enter the SSD market to expand its production line. Its new SSD series is going to compete for potential customers throughout the world with already established and renowned suppliers to this industry. The series comprises 4 models of 60GB, 120GB, 240GB, and 480GB capacity. All of them are based on SandForce SF-2281 controller and use MLC NAND flash-memory (synchronous). Those SSDs are also known to support SATA III high-speed interface.



The advantage of QUMO drives is primarily seen in their reduced power consumption and heat dissipation. The drives are equipped with a range of dedicated technologies that protect them from overloading, humidity, and other unfavorable impacts. All models promote for the quick 'cold' activation, while traditional HDDs require some time for the spindle spinning. The user receives a chance to get quick access to a random sector, without the necessity of moving the head. Stable data …

Nanoxia Launches the Second Deep Silence Chassis

Nanoxia has announced its plans to start shipping a new chassis series, codenamed Deep Silence 2. The first generation of Deep Silence PC chassis was introduced more than 1.5 year ago, however, all devotees of German standards and reliability were looking forward to the next product designed by Nanoxia. Deep Silence 2 is a Mid-Tower casing which supports the motherboards of ATX, E-ATX, mini-ITX, and micro-ATX standards. The new product will be available in four color gamuts: black, white, silver (front panels) and absolutely white edition.




Chassis Deep Silence 2 is distinguished by the implementation of heightened sound-proof casing properties. Internal part of side panels is finished with a dedicated sound-proof material, while PSU and drive sections accommodate rubber pads which mitigate the noise or vibration. Thus, this model will be a perfect match for those customers who long for quiet operation of their desktop platforms. This enclosure is ready to house CPU coolers …

Intel Makes an Agreement with ASML to Accelerate 450 mm Wafer Development

The past several days were marked by the Intel's announcement about the celebration of a contract with ASML company. Such step has been dictated by the company's intentions to invest into the development of 450 mm wafers and EUV technologies. In accordance with the preliminary estimates, the general investment rate will reach $4.1 billion. The major target of the cooperation is to decrease the term of lithography equipment commissioning by two years, and stimulate the development of technologies targeted at 450 mm wafers. The implementation of the predesigned plans will allow the manufacturers of semiconductor components to receive a range of benefits, among which is the cut of expenses.



With the purpose to facilitate in the solution of this technological problem, Intel will take part in a dedicated program. This program includes financial backup of scientific and research projects, as well as, equity investing campaigns in ASML.


The initial stage of this program …
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