PowerColor Intros New Graphics Card with Fling Force Cooler

TUL Corporation, in the framework of its PowerColor brand, introduces a new graphics card with quite an original way of air cooling organization. The new-coming adapter, codenamed PowerColor Radeon HD 7850 Fling Force, employs 'two-storied' cooler of an unusual structure. Along with an aluminum heatsink, copper heat pipes, and a voluminous fan, the manufacturer implemented non-monolithic fan ribs. Their tips are fixed to the main part in a way to change their location relative to the plain of rotation.

On conditions of low rotational speed, tips of the ribs are located at approximately 80 degrees angle relative to the graphics card. On conditions of heightened speed, the ribs become more linear; this way, the impeller diameter enlarges from 92 mm to 95 mm. Such structural approach to the fan framework develops into an improved performance and air cooling effect.

The model is based on Pitcairn chip, developed on Graphics Core Next architecture under 28 nm technological …

Gigabyte Readies Entry-Level Graphics Card GV-N640D5-2GI

Gigabyte is going to introduce one more entry-level graphics solution that corresponds to the updated Nvidia GeForce GT 640 series. Entitled Gigabyte GeForce GT 640 (GV-N640D5-2GI), the card employs GK107 GPU, running at 1046 MHz frequency instead of the preceding 900 MHz. The core, developed under 28 technological process, utilizes 384 CUDA cores.

It’s necessary to underline that the new-comer differs by the availability of 2 GB memory, whereas all etalon models take 1 GB only. Memory is represented by 64-bit GDDR5 chips that run at 5010 MHz effective frequency, if compared with 1800 MHz frequency that DDR3 modules demonstrate.

GV-N640D5-2GI comes with an improved design of PCB where a brand Ultra Durable 2 concept has been incorporated. This concept implies the employment of a high-quality hardware base, involving durable solid-state capacitors, transistors with low channel resistance RDS (on), and ferrite throttles with reduced power loss. Traditionally, the model …

Intel Broadwell CPUs will Get BGA Casing

The Internet community is energetically discussing unofficial info concerning the future Intel's Broadwell processors. According to the yet unacknowledged data, Intel will branch off from currently traditional LGA casings in favor to a more advanced BGA solution. At present all CPUs designed by Intel specifically for desktop platforms feature LGA (Land Grid Array) casings which allow the users to upgrade their systems without any hassle. On LGA implementation, the chip is housed within a socket and contacts with the motherboard. As a result, the user might change one chip to the other only with similar set of contacts.

The launch of Intel Broadwell processors, which is planned for 2014, might dramatically change the situation for customers. Most probably Intel will refuse from LGA casings and accommodate all new CPUs in BGA ones, marking the change of Haswell generation to the future Broadwell generation developed under 14 nm technological process. BGA (Ball Grid Array) …
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Registered at: 06 May 2011, 21:15
Last visit: 06 May 2011, 21:27