Iiyama Launches a New ProLite T2452MTS PC Monitor

Iiyama Corp., a renowned Japanese designer of hi-end TV panels and PC monitors, has started the sales of a new flagship 24-inch monitor in the internal market. Codenamed ProLite T2452MTS, the model features 556x403.5x122.5 mm dimensions. It also boasts a unique multi-touch technology, supporting two compatible touch points (available only on Windows 7). The price of the monitor is set at $390; it involves a special digital stylus to manipulate the multi-touch screen.



Iiyama T2452MTS is based on TN array and employs a power-saving LED backlit. It supports Full HD resolution (1920x1080) and demonstrates a quite fast response time (2 ms) in Gray-to-Gray environment. High-quality array ensures the following display specifications: static/dynamic contrast ratio – 1000:1/5M:1, typical/maximal brightness – 260/300 cd/m2, viewing angles – 170/160 H/V, amount of displayed tints – 16.7 m, light transmittance – 88%.


The interface panel comprises two HDMI ports, one …

Motherboard ASUS 970 Pro Gaming/Aura Overview

Let’s start with the general technical characteristics:


Processors: AMD Sempron, Athlon, Phenom II, FX, Socket AM3 and Socket AM3 +

Core logic chipset: AMD 970 + AMD SB950

RAM: 4 x DDR3 for DIMM socket

Supported memory: up to 64 GB (unbuffered, non-ECC); dual-mode support, AMD A.M.P. and Intel X.M.P; support for DDR3 1066/1333/1600/1866/2133/2400 (OC) + MHz

Audio: Realtek ALC1150 (up to 8 channels)

Network: 1xIntel I211AT (10/100/1000 Mbit)

Expansion slots: 1 PCI Express x16 2.0 slot (PCIE2), physically as x16

1 x PCI Express x16 2.0 (PCIE4) slot, physically as x8

2 PCI Express x1 2.0 slots (PCIE1 and PCIE3)

2 x PCI slots

Graphics tandems support: AMD CrossFire; NVidia SLI

Disk subsystem: AMD SB950; — 6 SATA2 3Gb/s ports, support for ACHI, NCQ, RAID 0, RAID 1, RAID 0 + 1.

USB: AMD SB950:

— 8 ports USB 2.0/1.1 (2 connectors on the board for connecting 4 ports, 4 ports on the back of the board)

ASMedia ASM1042A:

— 2 USB …

Intel Makes an Agreement with ASML to Accelerate 450 mm Wafer Development

The past several days were marked by the Intel's announcement about the celebration of a contract with ASML company. Such step has been dictated by the company's intentions to invest into the development of 450 mm wafers and EUV technologies. In accordance with the preliminary estimates, the general investment rate will reach $4.1 billion. The major target of the cooperation is to decrease the term of lithography equipment commissioning by two years, and stimulate the development of technologies targeted at 450 mm wafers. The implementation of the predesigned plans will allow the manufacturers of semiconductor components to receive a range of benefits, among which is the cut of expenses.



With the purpose to facilitate in the solution of this technological problem, Intel will take part in a dedicated program. This program includes financial backup of scientific and research projects, as well as, equity investing campaigns in ASML.


The initial stage of this program …
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Registered at: 13 April 2011, 10:57
Last visit: 13 April 2011, 10:57