Intel Makes an Agreement with ASML to Accelerate 450 mm Wafer Development

The past several days were marked by the Intel's announcement about the celebration of a contract with ASML company. Such step has been dictated by the company's intentions to invest into the development of 450 mm wafers and EUV technologies. In accordance with the preliminary estimates, the general investment rate will reach $4.1 billion. The major target of the cooperation is to decrease the term of lithography equipment commissioning by two years, and stimulate the development of technologies targeted at 450 mm wafers. The implementation of the predesigned plans will allow the manufacturers of semiconductor components to receive a range of benefits, among which is the cut of expenses.



With the purpose to facilitate in the solution of this technological problem, Intel will take part in a dedicated program. This program includes financial backup of scientific and research projects, as well as, equity investing campaigns in ASML.


The initial stage of this program …

The Launch of Motherboard Big Bang-ZPower from MSI is Round the Corner

On the threshold of international exhibition Computex ‘12, MSI has decided to boil up the interest of the potential customer audience to their new motherboard Big Bang-ZPower. So far, the company has highlighted only a few teasers, giving a superficial concept about their new product. There are not so many details revealed, but it’s definitely known that the motherboard will be based on Intel Z77 Express chips and support processors of Ivy Bridge and Sandy Bridge series.



The new Big Bang-ZPower is called to satisfy the needs of inveterate overclockers who appreciate might, functionality and framework. This model is intended to work with Intel Core i7/i5/i3 processors of the second or third generation in the implementation of Socket LGA1155. As seen from the teasers, the motherboard is equipped with the passive cooling system which employs heating tubes technology; in addition, this model will involve the enhanced power subsystem and UEFI with the diversified settings.

… …

Deepcool to Release an Updated Lucifer K2 Efficient CPU Cooler

Deepcool has introduced a ‘companion’ to its well-known cooler entitled Lucifer V2. The all-new Lucifer K2 features 163x146.5x131 mm dimensions and weighs 1047 g. The new-comer supports AMD and Intel platforms, including LGA2011-v3, LGA2011, LGA1366, LGA115x, LGA775 (Intel) & Socket FM2, FM2+, FM1, AM2, AM2+, AM3, AM3+ (AMD) as well as various CPUs with TDP level of not more than 130 W.



Deepcool Lucifer K2 boasts a purely-polished copper base, six copper heatpipes and an aluminum heatsink (140x110x163 mm). The latter ensures a large heat dissipation area. Despite having stately proportions, the cooler does not block off the access towards DIMM slots.


The key differentiation between V2 and K2 models lies in the choice of a fan. The previous solution featured a 140-mm item, while the newer one – a 120-mm fan, based on a fluid-dynamic bearing. The fan supports PWM technology that provides for a wide rotational range — from 600 RPM to 1800 RPM, — generating up to …
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