Antec Outs Budgetary GX500 Chassis

Antec, a well-known designer of multiple hardware solutions, has released a new budgetary chassis, codenamed GX500. The model is developed in mid-tower form-factor and features 205x476x458 mm dimensions. It is made of solid steel but is complemented by plastic patches. The case has got a totally black coating and minimum accessories. The customers are able to acquire the product for the recommended price tag of EUR 59.

Antec GX500 supports the integration of standard ATX, as well as detracted mini-ITX and micro-ATX motherboards. The internal layout is ready to accommodate two 5.25-inch drives, five 2.5/3.5-inch drives, and seven PCI expansion cards. Storage might be enlarged due to the availability of one more external 3.5-inch drive bay.

Spacing within the chassis is sufficient to pack ATX power supply unit, CPU cooler of 158 mm in height, graphics adapters of 380 mm in length, and heatspreaders (liquid-cooling) of 380 mm in length. The chassis’ exterior does not …

Thermalright Shows up a Hard-Hitting Archon IB-E X2 Cooler

Thermalright is about to release a new ‘tower’ CPU cooler, codenamed Archon IB-E X2. Featuring 155x106x170 mm dimensions, the model supports Intel LGA 2011/115x and AMD FM1/AM2+/AM3+/FM2+ platforms. The launch date is on hold, though the recommended price might rise up 65 EUR.

Thermalright Archon IB-E X2 consists of a voluminous aluminum heatsink with 43 thin pins, which are pierced by eight U-shape nickel-plated heatpipes, and a polished copper base also with a nickel-plated coverage.

The framework is replenished by two 140 mm fans Thermalright TY-141; they are thought to support PWM technology that promotes for speed variation from 900 RPM to 1300 RPM. The fan blades produce up to 74 CFM airflow, consuming not more than 2.4 W power. Average noise level fluctuates within the measures of 17-21 dB.

Moreover, the vendor equips the cooler with a brand thermal compound — Thermalright Chill Factor III. The latter transcends common Chill Factor item in terms of heat …

Processors Intel Haswell to Rival Accelerator NVIDIA Tesla

Intel Corporation has the intentions to introduce DDR4 memory into their server processors of Haswell series. The launch of such technological approach is planned for the 2014, however the developments in this sphere have already started. Intel’s server solutions will become a part of Grantley platform and the samples of their new series will allegedly be announced next autumn. The preview of new processors makes it clear that some of the chips will be distinguished by the increased heat generation performance which will reach 160 W.

Hence, 16-core processors Haswell-EP will rival parallel computing accelerator NVIDIA Tesla but not AMD server solutions. Intel is going to provide various working frequency options and options with different number of active cores. At the same time, TDP will fluctuate within ranges of 160, 145, 135, and 120 W. In its turn, accelerator NVIDIA Tesla, which is based on GK110 processor, consumes approximately 300 W.

In accordance with the …
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Registered at: 05 February 2012, 01:08
Last visit: 05 February 2012, 03:27