Deepcool Introduces a Universal IceEdge 400 E CPU Cooler

Deepcool Industries, a well-known Chinese designer of multifarious cooling solutions, is going to launch its newest universal CPU cooler, entitled IceEdge 400 E (Elite Edition). The new-comer has got a tower-type design and features 100x86x125.5 mm dimensions.

This model is predestined to be incorporated into all contemporary platforms, including Intel’s LGA775/1150/1155/1156 and AMD’s 754/939/940/FM1/FM2/AM2(+)/AM3(+). Moreover, it is able to cool down rather hot processors, which TDP level reaches 130 W.

Deepcool IceEdge 400 E consists of a heatsink block, featuring thin aluminum plates, four copper heatpipes that support direct contact technology, and a single 92 mm fan. The latter is based on a fluid bearing and develops speed up to 2200 RPM. The maximal noise level it is producing approximates 26 dB. The fan is fixed due to wire spikes.

Pricing and release date are still unknown.

Gelid Announces a New Black Edition Supercooler

Gelid, a company known for its high-end cooling systems, announces the release of a new air supercooler, codenamed Black Edition. This model is characterized by a prime cooling effect that is able to manage with even an overclocked red-hot processor. Upon the whole, Gelid Black Edition can boast a larger number of heat pipes, wider area of heat dissipation, and quieter operation.

Gelid Black Edition is known to support all contemporary CPU sockets designed by Intel (LGA 2011, 1366, 1156, 1155, 775) and AMD (FM1, FM2, AM2, AM2+, AM3, AM3+). This makes the cooler highly-compatible with versatile PC systems. The model is developed in the most spread tower framework with the two-section heatsink; this promotes for the installation of more than two fans which are able to ensure the maximal cooling activity. The base houses seven heat pipes (three of them feature 8 mm and four others — 6 mm). This implies that the model will play its best within the systems based on Intel X79 …

Micron to Carry Out the Production of TLC Memory Next Year

Memory market, similar to other industries, undergoes certain changes and updates from time to time. Therefore, memory manufacturers are currently trying to comply their production with two major tendencies: considerable drop in demand for RAM, employed basically in desktop PCs, and simultaneous growth of demand for solid-state drives, employed in compact tablets and mobile devices. Besides, the latter is developed at lightning speed.

Micron, one of the leading memory manufacturers, feels like no one else all the changes and fluctuations in the market. Its quarterly reports witness about the relentless drop in demand for DRAM (9% drop at average) for the report period. At the same time, increase in SSD segment is estimated at 5% at average. Sales volume of NOR memory type did not outlive serious changes.

According to the preliminary data, Micron is going to carry out the production of memory on TLC microchips, manufactured under 20 nm technological process. The assumed …
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Date of birth: 22 May 1962
Location: Россия, Козельск
Registered at: 14 June 2012, 00:02
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