Thermalright Shows up a Hard-Hitting Archon IB-E X2 Cooler

Thermalright is about to release a new ‘tower’ CPU cooler, codenamed Archon IB-E X2. Featuring 155x106x170 mm dimensions, the model supports Intel LGA 2011/115x and AMD FM1/AM2+/AM3+/FM2+ platforms. The launch date is on hold, though the recommended price might rise up 65 EUR.



Thermalright Archon IB-E X2 consists of a voluminous aluminum heatsink with 43 thin pins, which are pierced by eight U-shape nickel-plated heatpipes, and a polished copper base also with a nickel-plated coverage.


The framework is replenished by two 140 mm fans Thermalright TY-141; they are thought to support PWM technology that promotes for speed variation from 900 RPM to 1300 RPM. The fan blades produce up to 74 CFM airflow, consuming not more than 2.4 W power. Average noise level fluctuates within the measures of 17-21 dB.


Moreover, the vendor equips the cooler with a brand thermal compound — Thermalright Chill Factor III. The latter transcends common Chill Factor item in terms of heat …

Antec Outs Budgetary GX500 Chassis

Antec, a well-known designer of multiple hardware solutions, has released a new budgetary chassis, codenamed GX500. The model is developed in mid-tower form-factor and features 205x476x458 mm dimensions. It is made of solid steel but is complemented by plastic patches. The case has got a totally black coating and minimum accessories. The customers are able to acquire the product for the recommended price tag of EUR 59.



Antec GX500 supports the integration of standard ATX, as well as detracted mini-ITX and micro-ATX motherboards. The internal layout is ready to accommodate two 5.25-inch drives, five 2.5/3.5-inch drives, and seven PCI expansion cards. Storage might be enlarged due to the availability of one more external 3.5-inch drive bay.


Spacing within the chassis is sufficient to pack ATX power supply unit, CPU cooler of 158 mm in height, graphics adapters of 380 mm in length, and heatspreaders (liquid-cooling) of 380 mm in length. The chassis’ exterior does not …

Intel Makes an Agreement with ASML to Accelerate 450 mm Wafer Development

The past several days were marked by the Intel's announcement about the celebration of a contract with ASML company. Such step has been dictated by the company's intentions to invest into the development of 450 mm wafers and EUV technologies. In accordance with the preliminary estimates, the general investment rate will reach $4.1 billion. The major target of the cooperation is to decrease the term of lithography equipment commissioning by two years, and stimulate the development of technologies targeted at 450 mm wafers. The implementation of the predesigned plans will allow the manufacturers of semiconductor components to receive a range of benefits, among which is the cut of expenses.



With the purpose to facilitate in the solution of this technological problem, Intel will take part in a dedicated program. This program includes financial backup of scientific and research projects, as well as, equity investing campaigns in ASML.


The initial stage of this program …
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