Qualcomm to Enter Into Contract with GlobalFoundries

Qualcomm, a world-known provider of chips for mobile gadgets, has entered into a contract with GlobalFoundries company with the intention to develop chips based on 28 nm technology. Such information has been voiced by an authoritative Chinese publication Commercial Times, referring to the reliable sources. It is presupposed that the manufacturer will start the first dispatches for Qualcomm in the end of this year. The previously voiced data claimed that Qualcomm had arranged orders of 28 nm chips from UMC with the similar dispatch dates.



The estimated reason for the cooperation with GlobalFoundries is the insufficient delivery of 28 nm chips by TSMC. Moreover, Nvidia is supposedly targeting at the cooperation with one more manufacturer except for the TSMC as well. It should be mentioned that the preliminary memorandum between Qualcomm and GlobalFoundries was concluded in 2010; according to this memorandum, the designer got the access towards 45 nm LP and 28 nm LP technological …

Company LEPA produces new power supplies B-series

LEPA introduced three new power supplies — B650-SA, B700-MAS and the B800-MAS, which will replace older models B750-MA, and B850-MA. Newcomers have been certified with 80 Plus Bronze (efficiency of 88% of the networks 230V), and met the standards of ATX12V v2.3 and EPS12V 2.92, and positioned as solutions for gamers and owners of GPU configurations SLI and CrossFire, workstations and small servers.



New items are equipped with inverter DC-DC (to improve stability), have the topology of Double Forward Circuit, as well as high-quality electrical components: solid capacitors and heat resistant (105 ° C) capacitors made in Japan.


Active cooling LEPA B700-MAS/B800-MAS is provided by 140-mm fan on double bearings. The model B650-SA has a fan size of 120 mm. The intensity depends on the rates of temperature sensor. Power Cables PCI-E, SATA and Molex flat are detachable. The main ATX 24-pin, as well as “CPU” EPS12V 8-pin are collected in a nylon sheath. LEPA B650-SA has …

Urban S21: a New Mid-Tower Case from Thermaltake

Thermaltake Technology introduces a new PC case codenamed Urban S21. This is a regular mid-tower chassis with, as usual, high-quality framework and wide spectrum of destinations. Urban S21 is developed in a minimalistic design with all black coverage (external and internal) and little detailing. The model is housed in a steel casing (SECC) and contains a single transparent side window. Its overall dimensions equal to 438x185x497 mm.



This PC case is expected to accommodate motherboards of ATX and micro-ATX standard, CPU coolers of up to 155 mm in height, and graphics cards which length does not exceed the admissible 320 mm. The layout offers seven PCI expansion cards, three external 5.25-inch drive bays, one external 3.5-inch drive bay, and five internal bays for the integration of 3.5/2.5-inch drives.


Urban S21 is equipped with a frontal interface panel that is represented by a pair of USB 3.0 ports and a pair of 3.5 mm audio slots. The top panel contains handy ‘Power’ …
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Registered at: 23 February 2012, 13:36
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