Intel Makes an Agreement with ASML to Accelerate 450 mm Wafer Development

The past several days were marked by the Intel's announcement about the celebration of a contract with ASML company. Such step has been dictated by the company's intentions to invest into the development of 450 mm wafers and EUV technologies. In accordance with the preliminary estimates, the general investment rate will reach $4.1 billion. The major target of the cooperation is to decrease the term of lithography equipment commissioning by two years, and stimulate the development of technologies targeted at 450 mm wafers. The implementation of the predesigned plans will allow the manufacturers of semiconductor components to receive a range of benefits, among which is the cut of expenses.



With the purpose to facilitate in the solution of this technological problem, Intel will take part in a dedicated program. This program includes financial backup of scientific and research projects, as well as, equity investing campaigns in ASML.


The initial stage of this program …

Apple iMac Pro Monoblock Overview

Apple has recently conducted the WWDC 2017 conference. The corporation introduced the latest devices and upgrades, one of which is the iMac Pro monoblock computer. This specialty is a professional solution, satisfying the greatest demands of highend users.


Key features


iMac Pro has the most impressive configuration among all Mac products. It obtained up to 42 MB of cash mem, 18(!) cores and 4.5 GHz in the Turbo Boost mode, thus, providing effective multithread data processing, as well as high single-threaded applications operational velocity. The Hyper Threading technology lets easily perform particle systems modelling and rendering (static and animated) in 2D and 3D.



The novelty by Apple got the 8/10/18 cores Intel Xeon CPU, Radeon Pro Vega graphics processor, which ensures frame overfrequency in VR apps, real-time 3D-rendering support and ultimate gaming adjustments. The HBM2 module has replaced external VRAM memory, so the data import speed is 400 GB/sec. The …

Greeting One More Chassis of Urban Series from Thermaltake

Following the release of Urban S31 PC chassis, Thermaltake put its best foot forward to introduce one more representative of Urban series – Urban S41. This is a mid-tower case of a minimalistic design, with totally black exterior and interior. The model is vested in SECC steel coverage and will be available in two framework variations: with a large side-facet window and without it. In its entirety, the chassis features 516x220x520 mm dimensions and weighs 8.9 kg.



Thermaltake Urban S41 is ready to welcome all contemporary motherboards of ATX and micro-ATX standard. Despite its mid-tower framework nature, its internal capacity does not yield to some full-tower case species. Therefore, it positions four external drive bays of 5.25-inch format, five internal bays for 3.5-inch or 2.5-inch drives, and seven slots for PCI expansion cards. Additionally, the case is equipped with an external top-facet dock for the installation of drives with SATA interface (HDD/SSD). The frontal I/O …
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Registered at: 10 October 2012, 12:55
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