Foxconn Introduces Two Motherboards on Intel NM70 Chipset

Foxconn is proud to introduce a pair of new mini-ITX motherboards, developed on Intel NM70 chipset. Entitled D70S-P and D70S-PD, this couple is intended for the incorporation into small-sized, power-saving and low-noise PCs, workstations, network and multimedia stations. Both new-comers are initially equipped with two-core Intel Celeron U1037 CPUs (Ivy Bridge generation). They operate at 1.8 GHz and consume 17 W only.



Foxconn D70S-P and D70S-PD feature an integrated Intel HD Graphics core that ensures smooth and quality imaging on movie watching (support for Full HD resolutions), game playing (with average demands), Internet surfing, and work with various applications. Cooling of all crucial components, including the key computing block, is secured by means of an aluminum heatsink with an onboard low-profile fan. Despite the dimensions, 170x170 mm only, the product allows for the incorporation of any contemporary hardware pieces.


Therein, memory block consists of a single …

Silicon Power Unveils Armor A85M External Storage

Silicon Power Computer & Communications is about to kick off with the newest stress-proof external drive, entitled Armor A85M. The model, targeting Mac users, features 132.5x92.3x25.9 mm dimensions and completely complies with MIL-STD 810G Method 516.6 Procedure IV standard. It also enjoys IP68 protection rating. The new-comer will be shipped with a 3-year’s warranty; however, pricing is unknown yet.



The storage is thought to operate within a wide thermal range – from 5 to 55 C degrees. Moreover, it might be employed in tough conditions, i.e. submergence, fall from a height of 1.2 m, storing in extreme colds/heat (-40 C degrees — +70 C degrees).


SP Armor A85M will be available in three capacities: 500 GB, 1 TB and 2 TB. All of them are equipped with USB 3.0 interface with 5 Gb/sec bandwidth. The implemented USB port serves not only data transfer functions; it’s also a power cord. The case accommodates power and processing LED indicator.


In addition to the …

Cooler Master to Continue Its Series of Heatsinks with Vapor Chambers

Cooler Master has lately introduced its new lineup of coolers with the implementation of vapor chambers technology (TPC 812 series). However, the company's plans are not limited to this series only, and the upcoming release of V4 GT series is the most convincing proof of it. The new series will be based on horizontal vapor chamber technology and intended at the colling down of high-end graphics cards.



In accordance with the manufacturer's undertakings and plans, the implementation of this technology will provide for the octuple improvement of heat dispersion as compared with the solid copper-contact sink. This approach towards the processor's colling down enables the involvement of more heat pipes. Nevertheless, V4 GT model will be equipped with only four heat pipes.


Vapor chamber technology stipulates efficient removal of heat from the processor and other integral components. At the same time, it averts the creation of hot spots and promotes for the even distribution of …
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