LEPA NEOllusion CPU Cooler with an extraordinary LED backlighting

For the first time the LEPA NEOllusion CPU Cooler was demonstrated during the Computex 2016 exhibition. And the WOW moment is in its unique backlighting: LEDs are located not on the fan, but on the sides of the construction. Besides, their colour and work mode can be modified with the help of the control unit, which can be attached to the metal framework by magnetically charged legs.



The LEPA NEOllusion cooling system features the base, four 6 mm copper heat pipes with a direct contact to the CPU heat dissipation lid, the aluminum radiator and the 120 mm fan (its rotative speed range is 600–1800 rpm or 400–1000 rpm with a set adapter). With the special blades shape and excellent aerodynamic qualities it can pump the air flow of up to 128.12 m3/hr (up to 78.31 m3/hr with an adapter) at the static pressure of 2.41 mm H2O (0.9 mm H2O) and the noise grade of 33 dBA (19 dBA).


LEPA NEOllusion dimensions are 161.7 х 126 х 40 mm, and its weight is 645 g. It is compatible with …

The Launch of New Generation Core i3 is Planned for Early September

The recent launch of Intel's Ivy Bridge processors based on a new microarchitecture has touched upon Core i5 and Core i7 series. Currently, the company is working vigorously on the advancement of its Core i3 series, as well as, Pentium G2100T and G2120 models. The latter will be designed on similar to its 'brethren' architecture. In accordance with the voiced information, the new processors will be released in early September.



The nominal lineup of Core i3 processors will include five models; processors with T index (i3-3220T and i3-3240T) will be characterized by low power consumption (up to 35W) and average frequencies which will fluctuate in the ranges of 2.8-3 GHz. Senior models (i3-3220 and i3-3225) will operate at 3.3 GHz and have TDP index of 55W, while the superior model Core i3-3240 will achieve the frequency index of 3.4 GHz. These models are distinguished by the availability of more efficient integrated HD 4000 graphics type.


Upon the whole, the third …

Welcome In New LPDDR4 Memory Chips from Samsung

Samsung settles down to a large-scale production of LPDDR4 mobile memory chips. Elaborated according to 20 nm technological norms, the new-comers boast the integration of an advanced technology that ensures 8 Gb crystal density and twice the performance compared with LPDDR3 chips. Currently, the company produces models of 2 GB and 3 GB capacity, however in early 2015 it will set to the development of 4 GB solutions.



New LPDDR4 memory modules are targeting various mobile devices with thirst for lightning-fast data transfer speed. The latter index might accelerate up to 3200 Mb/sec; this will allow employing chips for the implementation of resource-intensive tasks, such as recording and playback of high-resolution video or serial filming.


Samsung developers claim that 2 GB LPDDR4 DRAM is 40% more power-efficient than counterparts with 4 Gb crystal density. This became possible due to the adopting of low-voltage swing-terminated logic for I/O signaling. As a result, the …
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Registered at: 08 November 2012, 13:45
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