ASRock Surfaces J3355B-ITX Mainboard

ASRock enters the market with a mainboard, targeting new Intel Apollo Lake CPUs (14 nm, Intel Goldmont micro-architecture). The J3355B-ITX model is thought to be integrated within laptops or entry-level all-in-one solutions. As seen from the codename, the board is developed in mini-ITX form-factor. It comes equipped with Intel Celeron J3355 processor, operating at 2.0-2.5 GHz frequency. The CPU features 10 W TDP; hence, cooling is backed by a noiseless passive cooler.



ASRock J3355B-ITX accommodates a pair of SO-DIMM slots for DDR3/DDRL3 modules with 1866 MHz frequency (up to 16 GB). The board comes with an integrated Intel HD Graphics 500 GPU that runs at 700 MHz. The connection of drives is realized via two SATA III ports. The incorporated PCIe 2.0 x16 slot is optimal for expansion cards, rather than a VGA card.


To continue, audio subsystem is based on 7.1-channel Realtek ALC887 controller, whereas network facilities are ensured with the help of Realtek RTL8111GR …

Sapphire Showcases Radeon HD 7870 GHz Edition Toxic Solution

Sapphire Technology Ltd. is going to release a new graphics card on Tahiti LE chip. Codenamed Radeon HD 7870 GHz Edition Toxic, the card is one of the first models to use the newest GPU, developed under 28 nm technological process. The suffix 'GHz Edition' in the model's name witnesses that the nominal GPU clock frequency exceeds the index of 1 GHz.



The core of Sapphire Radeon HD 7870 GHz Edition Toxic is based on Graphics Core Next architecture and contains 1536 current processors. The card's inventory involves 2GB of GDDR5 memory with 256-bit bus interface. The memory modules are known to operate at 6000 MHz frequency. GPU operational frequencies are still not clarified, but it's possible to assume that on activation of AMD PowerTune option the card will demonstrate some outstanding performance. In fact, analysts dare saying that this model is the most efficient one among all other solutions based on Tahiti LE chip.


Optimal thermal regime and airflow activity are …

Intel Makes an Agreement with ASML to Accelerate 450 mm Wafer Development

The past several days were marked by the Intel's announcement about the celebration of a contract with ASML company. Such step has been dictated by the company's intentions to invest into the development of 450 mm wafers and EUV technologies. In accordance with the preliminary estimates, the general investment rate will reach $4.1 billion. The major target of the cooperation is to decrease the term of lithography equipment commissioning by two years, and stimulate the development of technologies targeted at 450 mm wafers. The implementation of the predesigned plans will allow the manufacturers of semiconductor components to receive a range of benefits, among which is the cut of expenses.



With the purpose to facilitate in the solution of this technological problem, Intel will take part in a dedicated program. This program includes financial backup of scientific and research projects, as well as, equity investing campaigns in ASML.


The initial stage of this program …
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