ASRock Unleashes Hyper OC Series of Overclocking-Oriented Mainboards

ASRock is thought to be an innovator in the development of hardware know-hows. The Computex 2016 came as no exclusion: the company introduced a lineup of overclocked mainboards which joined Hyper OC series. Initially, the lineup consisted of three models – H170 Pro4/Hyper, B150M Pro4/Hyper & H110M-DS/Hyper; further on, it will be replenished by three other models – Fatal1ty H170 Performance/Hyper, Fatal1ty B150 Gaming K4/Hyper & B150A-X1/Hyper.

As seen from the codenames, the motherboards are based on Intel B150, H170 and H110 chipsets which employ ASRock Hyper BCLK Engine controller; it overclocks Intel Skylake CPUs by means of BCLK alteration, without dislocating other components. The new-comers support the installation of superfast DDR4 RAM, graphics cards with PCI-e 3.0 x16 interfaces as well as voluminous drives (including Ultra M.2).

ASRock H170 Pro4/Hyper features the following specifications:

— chipset: Intel H170;

— memory: 4x DDR4;

— storage: …

The new version of the chassis from Zalman Z9 Plus

The company Zalman continues to utilize the design of the whole successful chassis Z9, releasing a new model Z9 Plus D4-U3. Perhaps, the only difference from the recent Z9 U3 is the lower part of the front panel, made in the form of letter D.

The list of applied characteristics has remained the same. The body is made of steel and plastic in the form factor Mid-Tower. Its dimensions are 504 (L) x 207 (W) x 464 (H) mm, weight — a little over 7 lbs. Inside can be placed the motherboard ATX or microATX, seven cards PCI-E expansion up to 290 mm, ATX-compatible power supply, three optical drives, and seven hard drives, including two SSD 2.5 format.

The set includes two 120-mm fan — in front with the LED-backlit display and on the back without it. On the input-output is a small information display, two USB 3.0 ports and USB 2.0, Mini-Jack connectors for headphones and microphone.

Zalman Z9 Plus D4-U3 will debut in Japan and perhaps in some other markets, August 19 at a …

ECS to Implement AMD Memory Profile Support into Its Motherboards

AMD has won a reputation not only for designing and supplying high-end processors but also for introducing its brand memory expansion, codenamed AMD Memory Profile. This development is called to store and share memory settings profiles and to facilitate the search for the most rational settings. Thus, ECS company is going to implement AMP support for DDR3 memory into its future and current lineup of motherboards. According to the available data, AMP technology will be applied to the upcoming motherboards with AMD processors, and to the current products by means of UEFI firmware update. This is the first 'revival' of the technology since its reconsideration and upgrade.

The integrated technology is destined to setup new frequency, voltage and timings showings which will facilitate in keeping DDR3 memory modules stable. As a rule, random-access memory with high frequencies of more than 2GHz require manual system overclocking. AMP will prevent the emergence of errors while setting …
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Registered at: 07 July 2012, 10:27
Last visit: 12 July 2012, 09:01