Thermaltake Unveils Extraordinary Core G3 PC Chassis

Thermaltake decided to gladden its fans with the release of an offbeat chassis – the Core G3. The new-comer is differentiated by a slim profile (454x371x140 mm); however, it might be used for the fitting of various gaming configurations. Despite Slim Tower framework, the model is able to accommodate motherboards of full ATX form-factor with two expansion slots.



Thermaltake Core G3 might be employed as vertically so horizontally. Inner space is sufficient for the integration of 310-mm long graphics cards, SFX power supply units as well as 110-mm high CPU coolers. Besides, the availability of PCI Express riser allows for the mounting of the videocard in dual positions: parallel or perpendicular to the motherboard.


In order to enhance cooling performance, the user is free to integrate a liquid cooling system with a 240-mm heatsink. Initially, the chassis is furnished with two frontal 120-mm fans; one more 120-mm fan can be installed on the top facet. All cooling slots are …

Graphics Card MSI N650 Ti PE 1GD5/OC Review

PC hardware of average price category is traditionally in demand with a wide range of customers. Graphics cards are not exception, especially if the manufacturers offer truly outstanding facilities for comparatively medium price. The launch of GeForce GTX 650 Ti adapter raised an army of graphics solutions based on it; still, each company tries to deviate in some terms from the reference model. Thus, MSI introduced N650 Ti Power Edition 1GD5/OC model which takes GTX 650 Ti adapter as the basis, but employs fundamentally original printed circuit board and cooling system.



Integration


Graphics card MSI N650 Ti PE 1GD5/OC features all attributes ascribed to Power Edition series. Printed circuit board has been elongated to 230 mm, as compared to the 154 mm in reference GeForce GTX 650 models. Along with the PCB elongation, MSI implemented a reinforced 5-phase VRM scheme (4+1) that is intended at operational intensification on heightened frequencies. The connection of additional …

Next year TSMC will start manufacturing the first 20nm chips

The Taiwanese company TSMC confirmed its intention to start production of chips using 20 nm technological processes in 2013. However, for now the company does not plan its production on an industrial scale and will release the first chips in a limited quantities, giving them a total of 1% of production capacity. According to the head of the company, the mass production of semiconductor chips with this technology will not begin until 2014.



Meanwhile TSMC Company is going to produce only one version of the chip, which will be able to enter into the wide range of devices, from smart phones with low-power to high-performance graphics cards. For comparison, the Taiwanese company currently has four different output chips on 28-nm technology. These are 28LP (poly / SiON) for low-power low-cost chips, 28HPL (HKMG) for use in low power applications, 28HP (HKMG) for high-performance chips and 28HPM (HKMG). The latest version combines elements of high-performance chips with high efficiency …
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Registered at: 13 March 2012, 02:03
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