Thermaltake Readies Armor A30i and A30i Speedy Edition PC Cases

Thermaltake gets ready for the release of two new PC cases, codenamed Armor A30i and Armor A30i Speedy Edition. Both models feature 266x291x456 mm dimensions and boast an original modular framework, known as Bulletproof Armor Design. The cases are housed in a stylish enclosure with a small transparent window on the side panel, ventilation grids on the frontal and top facets. Their prime target is gamers, as well as enthusiasts and LAN Party devotees, who prefer small-sized PC systems.

Thermaltake A30i and its modified version are known to support motherboards of mini-ITX and micro-ATX standard, graphics cards of up to 350 mm in length, and CPU cooler of up to 90 mm in height. Internal layout is ready to offer four expansion slots, a couple of 5.25-inch drive bays (external), one 3.5-inch drive bay (external), a pair of internal 2.5-inch bays and analogous number of internal 3.5-inch bays. The frontal I/O panel consists of two standard audio slots and a couple of USB 3.0 ports. … …

PSU Enermax Platimax 850W Review

Platimax series belongs to the top line of power supply units designed by Enermax. The series includes seven models, ranging from 500W to 1500W power, which are characterized by the operational temperature scope from 0 to 50 degrees and the correspondence to 80Plus Platinum standard. Model Platimax 850W (codename EPM850EWT) is a worthy ambassador of the whole production line, due to its reliable, stable and efficient work.

General Specifications

Enermax Platimax 850W unit is developed with the employment of high-quality Japanese capacitors that ensure stability of operation on any work mode. Its design resembles a lot the one seen in Revolution87+ PSU series, although instead of yellow, Platimax uses gray color in combination with a black one. The unit is housed in a fingerprint- and scratch-proof case with a frosting finish. One of the side panels features a conspicuous Platimax logo that adds supremacy to the model. The frontal panel accommodates On/Off switch and a …

Intel Broadwell CPUs will Get BGA Casing

The Internet community is energetically discussing unofficial info concerning the future Intel's Broadwell processors. According to the yet unacknowledged data, Intel will branch off from currently traditional LGA casings in favor to a more advanced BGA solution. At present all CPUs designed by Intel specifically for desktop platforms feature LGA (Land Grid Array) casings which allow the users to upgrade their systems without any hassle. On LGA implementation, the chip is housed within a socket and contacts with the motherboard. As a result, the user might change one chip to the other only with similar set of contacts.

The launch of Intel Broadwell processors, which is planned for 2014, might dramatically change the situation for customers. Most probably Intel will refuse from LGA casings and accommodate all new CPUs in BGA ones, marking the change of Haswell generation to the future Broadwell generation developed under 14 nm technological process. BGA (Ball Grid Array) …
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Registered at: 23 August 2012, 09:08
Last visit: 23 August 2012, 12:26