Deepcool to Release Neptwin V2 CPU Cooler

Deepcool Industries Co. LTD has enriched its production line with a new CPU cooler, entitled Neptwin V2. Featuring 125x136x159 mm dimensions, the model allows for the installation of up to four fans, combined with a nickel-plated base, six copper heat pipes and a two-section voluminous heatsink which consists of 80 ribs (40 ribs for each section).

This cooler is known to support all up-to-date platforms, developed by Intel and AMD. As distinct from the majority of rivals, the Neptwin V2 framework is ready to accept four fans which operate by means of PWM technology. The base version comes with only two fans. The first one – Deepcool Wind Blade 120 – is equipped with a blue backlight; its rotational speed range varies from 900 to 1500 RPM. The second fan rotates at 1300 RPM. An overall noise level fluctuates within 21.4-32.1 dB boundaries.

It should be mentioned that total airflow volume produced by the fans might achieve 110.8-237.15 m/h. As a result, the cooler is …

Thermaltake Readies Armor A30i and A30i Speedy Edition PC Cases

Thermaltake gets ready for the release of two new PC cases, codenamed Armor A30i and Armor A30i Speedy Edition. Both models feature 266x291x456 mm dimensions and boast an original modular framework, known as Bulletproof Armor Design. The cases are housed in a stylish enclosure with a small transparent window on the side panel, ventilation grids on the frontal and top facets. Their prime target is gamers, as well as enthusiasts and LAN Party devotees, who prefer small-sized PC systems.

Thermaltake A30i and its modified version are known to support motherboards of mini-ITX and micro-ATX standard, graphics cards of up to 350 mm in length, and CPU cooler of up to 90 mm in height. Internal layout is ready to offer four expansion slots, a couple of 5.25-inch drive bays (external), one 3.5-inch drive bay (external), a pair of internal 2.5-inch bays and analogous number of internal 3.5-inch bays. The frontal I/O panel consists of two standard audio slots and a couple of USB 3.0 ports. … …

Cooler Master to Continue Its Series of Heatsinks with Vapor Chambers

Cooler Master has lately introduced its new lineup of coolers with the implementation of vapor chambers technology (TPC 812 series). However, the company's plans are not limited to this series only, and the upcoming release of V4 GT series is the most convincing proof of it. The new series will be based on horizontal vapor chamber technology and intended at the colling down of high-end graphics cards.

In accordance with the manufacturer's undertakings and plans, the implementation of this technology will provide for the octuple improvement of heat dispersion as compared with the solid copper-contact sink. This approach towards the processor's colling down enables the involvement of more heat pipes. Nevertheless, V4 GT model will be equipped with only four heat pipes.

Vapor chamber technology stipulates efficient removal of heat from the processor and other integral components. At the same time, it averts the creation of hot spots and promotes for the even distribution of …
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Registered at: 30 December 2011, 19:38
Last visit: 30 December 2011, 19:38