High-End NAS Series TS-x69 from QNAP

QNAP, an outstanding supplier of network attached storages and NVR solutions, announces the release of a new high-end NAS series TS-x69. The series is represented by five models with two (TS-269 Pro), four (TS-469 Pro), five (TS-569 Pro), six (TS-669 Pro) and eight (TS-869 Pro) disk bays. All the models support hot drive swapping activity that does not require cessation of all operations when there is a need to change one of the drives. Under the company's idea, these NAS products are targeting small and middle business as a primary goal.

All five models are based on two-core Intel Atom D2700 processor, the nominal clock frequency of which achieves 2.13 GHz. TS-x69 models are equipped with DDR3 memory type of 1GB capacity; if there is a necessity, the user is able to enlarge the volume to 3GB. All storages support the integration of hard drives with the maximal 4TB capacity and high-speed SATA III 6 Gb/sec interface. Interface set is introduced by identical ports and outputs …

Seagate Showcases New Enterprise-Class HDD Models

Seagate, one of the global leaders in HDD/SSD market, has elaborated and showcased two new enterprise-class HDD models. Codenamed Seagate Enterprise Performance 10K HDD v7 and Seagate Terascale, both entries are intended to be employed in data-centers and cloud storage systems. According to the designers, the drives are an optimal combination of capacity, efficiency and price. Hence, such specifications can’t but draw huge attention.

The first model, Seagate Enterprise Performance 10K HDD v7, is developed in 2.5-inch form-factor and utilizes SAS 6 internal interface. It comes in 1200 GB capacity with 64 MB cache-memory on board. The maximal spindle rotational speed achieves 10 thousand RPM, while the average index of power consumption makes up 8.02 W.

This HDD is primarily notable by low data access lags, as well as by high efficiency in the majority of working modes. Besides, it supports FIPS Self-Encrypting Drive and Protection Information technologies that are called …

Intel Makes an Agreement with ASML to Accelerate 450 mm Wafer Development

The past several days were marked by the Intel's announcement about the celebration of a contract with ASML company. Such step has been dictated by the company's intentions to invest into the development of 450 mm wafers and EUV technologies. In accordance with the preliminary estimates, the general investment rate will reach $4.1 billion. The major target of the cooperation is to decrease the term of lithography equipment commissioning by two years, and stimulate the development of technologies targeted at 450 mm wafers. The implementation of the predesigned plans will allow the manufacturers of semiconductor components to receive a range of benefits, among which is the cut of expenses.

With the purpose to facilitate in the solution of this technological problem, Intel will take part in a dedicated program. This program includes financial backup of scientific and research projects, as well as, equity investing campaigns in ASML.

The initial stage of this program …
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Registered at: 07 September 2012, 13:03
Last visit: 07 September 2012, 13:03