The Forthcoming Switch to 5 mm HDD Models

Nowadays HDD segment is represented by various products from various companies. However, with the development and release of ultrabooks, manufacturers directed their production to the hybrid-type drives. This resulted in the predominance of hybrid solutions in the market.

Recently Itel has advanced a motion to digress somehow from the production of hybrid drives and switch to the decrease of traditional HDDs dimensions to 5 mm in casing depth. According to the company's assumptions, such change could moderate the price for drives and provide the necessary volume capacity for ultrabooks.

Some manufacturers have already directed a part of their technological powers to the design of HDDs with 5 mm casings. Nevertheless, there appeared a couple of obstacles on their way: the necessity to stabilize data reading and writing activities, and increase of costs spent on drives' production. This will result in the rise of end price.

IT professionals and analysts forecast the …

Next year TSMC will start manufacturing the first 20nm chips

The Taiwanese company TSMC confirmed its intention to start production of chips using 20 nm technological processes in 2013. However, for now the company does not plan its production on an industrial scale and will release the first chips in a limited quantities, giving them a total of 1% of production capacity. According to the head of the company, the mass production of semiconductor chips with this technology will not begin until 2014.

Meanwhile TSMC Company is going to produce only one version of the chip, which will be able to enter into the wide range of devices, from smart phones with low-power to high-performance graphics cards. For comparison, the Taiwanese company currently has four different output chips on 28-nm technology. These are 28LP (poly / SiON) for low-power low-cost chips, 28HPL (HKMG) for use in low power applications, 28HP (HKMG) for high-performance chips and 28HPM (HKMG). The latest version combines elements of high-performance chips with high efficiency …

Lifting the Veil from USB Type-C Bus

Since the launch in 1995, Universal Serial Bus (USB) has proved itself as the most successful ever computing interface. Nowadays tens of billions of electronic devices are connected together due to it. It goes without saying that this bus has outlived a few modifications, each distinguished by higher speed and reliability. Thus, today the community is able to revel in a completely new modification – USB Type-C – that forecasts a lot privileges of connectivity process. Let’s see what users will get with a new bus.

Layout and Connectivity

In physical terms, Type-C is a bit larger than USB 2.0 Micro-B but a bit tinier than binary USB 3.0 Micro-B, featuring 8.34x2.56 mm. Such dimensions enable its connection to the devices of any type, including the thinnest smartphones/tablets. The oval-shaped socket houses 24 contact outputs (to compare: USB 3.0 sockets feature only 9 outputs).

The most outstanding physical peculiarity of Type-C is a symmetric connector that …
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Registered at: 11 January 2012, 09:04
Last visit: 11 January 2012, 09:14