Zalman ZM-GVM Introduces ZM-GVM Bronze PSUs

Zalman adds another series of power supply units to its portfolio. The ZM-GVM series is represented so far by three semi-modular units of 500 W, 600 W and 700 W capacity. They correspond to ATX12V 2.31 standard and boast 80Plus Bronze certificate since their efficiency achieves 88%. The new-comers are able to operate in a wide range of input voltages (115-230 V), featuring only a single +12V rail.



Zalman ZM-GVM units employ dual forward converter as the basis. Semi-modular design presupposes permanent fixture of the main cables and demountable construction of optional cables. Efficient cooling is the task for a low-noise 120-mm fan, whereas sustainability of the units is entrusted to the advanced protection system.


Zalman ZM500-GVM PSU accommodates 1x 24-pin connector, 4+4-in ATX 12V, 3x MOLEX, 5x SATA, 1x FDD, and 2x 6+2-pin PCI Express connectors. The ZM600-GVM offers 4x MOLEX and 6x SATA connectors in addition to the base ones. The senior ZM700-GVM houses 4x MOLEX …

Thermaltake Showcases an Original Bigwater 760 Pro Cooling System

Thermaltake Technology, a renowned Taiwanese designer of varied PC hardware pieces, is going to release its new original water-cooling system, codenamed Bigwater 760 Pro. This cooler is targeting powerful processors that require no less powerful cooling. The product demonstrates a wide compatibility with all novel processors that support Socket LGA775, LGA1366, LGA115x, LGA2011, FM1, FM2, AM2(+), and AM3(+).



Bigwater 760 Pro consists of three major parts: waterblock, head block and a couple of hoses. The implemented waterblock features nickeled-copper base of 45x35 mm dimensions. The head block features 252.8x145.8x84 mm dimensions and takes two 5.25-inch bays within the chassis. Its framework involves a pump, a heatsink and a tank for coolant.


The pump is based on a ceramic bearing and produces not more than 16 dB noise. Its performance level achieves 500 liters/hour, while Mean Time Between Failures index is estimated at eighty thousand hours. The integrated heatsink is …

Intel Broadwell CPUs will Get BGA Casing

The Internet community is energetically discussing unofficial info concerning the future Intel's Broadwell processors. According to the yet unacknowledged data, Intel will branch off from currently traditional LGA casings in favor to a more advanced BGA solution. At present all CPUs designed by Intel specifically for desktop platforms feature LGA (Land Grid Array) casings which allow the users to upgrade their systems without any hassle. On LGA implementation, the chip is housed within a socket and contacts with the motherboard. As a result, the user might change one chip to the other only with similar set of contacts.



The launch of Intel Broadwell processors, which is planned for 2014, might dramatically change the situation for customers. Most probably Intel will refuse from LGA casings and accommodate all new CPUs in BGA ones, marking the change of Haswell generation to the future Broadwell generation developed under 14 nm technological process. BGA (Ball Grid Array) …
AUTOMATIC SEARCH & INSTALL
device drivers
Freeware
Download (9MB)
DevID agent v4.36
* The Utility requires installation. Upon installation and running DevID Agent will detect
which devices require drivers and which drivers require updates.
The Utility doesn't contain viruses or malicious code
Registered at: 11 October 2012, 01:41
Last visit: 11 October 2012, 01:41